Method using slicing machine to cut high-standard seed crystal of ingot

A slicer and seed crystal technology, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of sawing loss, difficulty in preparing seed crystals, and inability to solve them well, so as to reduce export chipping Effect

Inactive Publication Date: 2014-07-16
NANTONG ZONGYI NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 1. The surface roughness is 6-8um, high roughness
[0010] 2. Because the silicon material is a hard material, when the band saw cuts to the remaining 1-2mm of the edge of the silicon rod, it is very easy to cause chipping due to the high-speed movement and vibration of the band saw
[0011] 3. The thickness of the normal band saw is about 1mm,

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0031] A method of cutting ingots with slicer cutting ingots, including the following steps:

[0032] Step 1: Plug the raw material stick to the seed crystal on the resin board;

[0033] Step 2: Install the adhesive silicon rod on the slice machine, and use a multi -line cutting machine to cut it by single -wire cutting. Among them, the threaded steel wire is selected, the density of the mortar is 1.71kg / L, and the line diameter is 135um;

[0034] Step 3: Dalfly: Take out the cut silicon rod, remove it from the slicer, put it in a gum -off groove, spray to remove the mortar, spray the mortar time to remove the mortar is 10min, the spraying pressure is 2MPa, and then enter the dewood tank for dehydration.The time to enter the gum tank is 20min, the water temperature is 70 ° C, and the lactic acid anti -oxidation protection is added, and the lactic acid concentration is 30%;

[0035] Step 4: After the dehydration is completed, perform ultrasonic cleaning, clean and use potassium hyd...

specific Embodiment 2

[0038] A method of cutting ingots with slicer cutting ingots, including the following steps:

[0039] Step 1: Plug the raw material stick to the seed crystal on the resin board;

[0040] Step 2: Install the adhesive silicon rod on the slice machine, and use a multi -line cutting machine to cut it by single -wire cutting. Among them, the threaded steel wire is selected, the density of the mortar is 1.72kg / L, and the line diameter is 145um;

[0041] Step 3: Dalfly: Take out the cut silicon rod, remove it from the slicer, put it in the gum -off groove, spray to remove the mortar, spray the mortar time to remove the mortar is 15min, the spray pressure is 2.5MPa, and then enter the dewood tank for performed for permanentThe time to enter the gel slot is 25min, the water temperature is 75 ° C, and the lactic acid concentration is 35%; the lactic acid concentration is 35%;

[0042] Step 4: After the dehydration is completed, perform ultrasonic cleaning, use the cleaning agent of potassiu...

specific Embodiment 3

[0045] A method of cutting ingots with slicer cutting ingots, including the following steps:

[0046] Step 1: Plug the raw material stick to the seed crystal on the resin board;

[0047] Step 2: Install the adhesive silicon rod on the slice machine, and use a multi -line cutting machine to cut it by single -wire cutting. Among them, the threaded steel wire is selected, the density of the mortar is 1.715kg / L, and the line diameter is 140um;

[0048] Step 3: Dalfly: Take out the cut silicon rod, remove it from the slicer, put it in a gum -off groove, spray to remove the mortar, spray the mortar time to remove the mortar is 13min, the spray pressure is 2.3MPa, and then enter the dewood tank for performed for performed by the deserture tank for permission.The time to enter the gel slot is 23 minutes, the water temperature is 72 ° C, and the lactic acid concentration is 33%; the lactic acid concentration is 33%;

[0049] Step 4: After the dehydration is completed, perform ultrasonic cl...

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PUM

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Abstract

The invention discloses a method using a slicing machine to cut a high-standard seed crystal of an ingot. The method comprises the step one of bonding a raw material bar of the seed crystal to be cut on a resin plate, the step two of placing the bonded raw material bar into the slicing machine to be cut, the step three of carrying out debonding after cutting is finished, the step four of cleaning, the step five of drying and the step six of checking and packaging. According to the method, the slicing machine originally cutting a silicon chip with the thickness of about 0.2mm is utilized for cutting the high-standard seed crystal with the cutting thickness of 17mm.

Description

Technical field [0001] The present invention specifically involves a method of cutting high standard seed crystals with slicer cutting ingots. Background technique [0002] In today's rapid development of the photovoltaic industry, crystal silicon used in the manufacture of solar cells is mainly a single crystal silicon with direct pulling method and polysilicon with ingot technology.Polycrystalline silicon -cast ingot, with large amount of feeding, simple operation, low process cost, but low battery conversion efficiency and short life; direct pull single crystal silicon conversion efficiency, but a small single -submitting, complex operation, and high cost.Therefore, how to combine the two into one and avoid the weaknesses have become the hot spots and difficulties of domestic and foreign photovoltaic companies.In this context, the quasi -single crystal between polysilicon and monocrystalline silicon gradually entered people's vision. [0003] Mono Like is a technology based on...

Claims

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Application Information

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IPC IPC(8): B28D5/04
Inventor 赵朋占李振华
Owner NANTONG ZONGYI NEW MATERIAL
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