Air tightness surface acoustic wave element package structure and manufacturing method thereof

Abstract

The invention discloses an air tightness surface acoustic wave element package structure and a manufacturing method thereof. The package structure comprises an upper glass cover plate array, a lower glass substrate array and a plurality of surface acoustic wave chips; a plurality of the surface acoustic wave chips are attached to the lower glass substrate array; the upper glass cover plate array and the lower glass substrate array are aligned and laminated through an adhesive to form a plurality of cavities; a plurality of upper glass cover plates of the upper glass cover plate array, a plurality of lower glass substrates of the lower glass substrate array, a plurality of surface acoustic wave chip and a plurality of the cavities all correspond to one another; and the surface acoustic wavechips are located in the corresponding cavities. The air tightness surface acoustic wave element package structure and the manufacturing method thereof in the invention simplify packaging of the conventional surface acoustic wave component, and greatly increase the throughput of the process, thereby greatly improving the production efficiency.

Description

technical field [0001] The invention relates to a surface acoustic wave component packaging structure, in particular to an airtight surface acoustic wave component packaging structure and a manufacturing method, belonging to the field of surface acoustic wave component packaging. Background technique [0002] Surface Acoustic Wave (SAW, Surface Acoustic Wave) is an elastic wave that propagates along the surface of an object. Surface acoustic wave is a kind of sound wave whose energy is concentrated on the ground surface and propagated by the British physicist Rayleigh (Rayleigh). [0003] In 1965, R.M.White and F.W.Voltmer of the United States published a paper entitled "A New Type of Surface Acoustic Wave Acoustic-Electric Converter", which made metals that can excite surface acoustic waves on the surface of piezoelectric materials. Interdigital Transducer (IDT), realize the mutual conversion of sound waves and electromagnetic waves, see attached Figure 1 . [0004] On t...

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Problems solved by technology

[0008] 2) Cut the piezoelectric material wafer into a single surface acoustic wave element chip (the surface acoustic wave element is very similar to the bare chip of the integrated circuit at this time); due to the hard, brittle and fragile characteristics of the massage material, the piezoelectric wafer Very difficult to cut;

[0011] In this packaging structure, the price of the ceramic substrate used is high; the dimensional stability is poor (using high temperature sintering over 1000 degrees Celsius); in addition, it is difficult to cut. Of course, there is also a pre-split process now, which makes the ceramic substrate very easy to break during the packaging process.

[0012] The metal cover used in this structure is used for sealing and welding. Due to the large difference in expansion coefficient between metal and ceramics, in the high-temperature process of the packaging process, it is not possible to use a large-area one-time mounting and welding method, and only a single shielding can be used. Caps (mm size) are welded and mounted, limiting the throughput of the entire process

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