Electromagnetic shielding structure manufacturing process and electromagnetic shielding structure

Abstract

The application provides an electromagnetic shielding structure manufacturing process and an electromagnetic shielding structure, which relate to the technical field of semiconductor packaging. The manufacturing process of the electromagnetic shielding structure includes forming a first bonding pad, a second bonding pad and a plurality of third bonding pads on the substrate, wherein the plurality of third bonding pads are arranged at intervals and surround the first bonding pad and the second bonding pad ; between the third pads, the first connection wires with grounding properties are arranged in a staggered distribution; the chip is mounted on the substrate; wherein, the chips are respectively electrically connected to the first pad and the second pad, and are located at the first connection online; form a plastic package on the substrate, and plant balls on the side of the substrate away from the plastic package; cut the plastic package and the substrate along the dicing line to form a single product; wherein, the dicing line is located on the third pad close to the chip side, so that the first connection line is exposed from the side of the plastic package after cutting; a metal layer is formed on the surface of the plastic package of a single product, so that the metal layer is electrically connected to the first connection line, and a good electromagnetic shielding effect is achieved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor packaging, in particular to a manufacturing process of an electromagnetic shielding structure and an electromagnetic shielding structure. Background technique [0002] In the existing system-level package module electromagnetic shielding technology, the grounding wire is usually arranged on the edge of the substrate cutting line. After the cutting process, a single product is formed, and then the film is applied to the back of the single product substrate and metal sputtering is performed to achieve the grounding wire. It communicates with the metal layer circuit to realize the electromagnetic shielding effect of the product. [0003] In this manufacturing process, cutting deviation is likely to occur during the cutting process, resulting in a short circuit of the grounding shielding wire, which leads to failure of the electromagnetic shielding performance of the product and affects ...

AI Technical Summary

Problems solved by technology

[0003] In this kind of manufacturing process, cutting deviation is likely to occur during the cutting process, resulting in a short circuit of the grounding shielding wire, which leads to the failure of the electromagnetic shielding performance of the product and affects product quality.

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