Crystal supplementing device for ultra-large substrate
A substrate and super-large technology, applied in the field of crystal replenishment equipment for super-large substrates, can solve problems such as the absence of super-large substrate crystal replenishment, achieve automation and precision, and improve the efficiency of crystal replenishment
Active Publication Date: 2020-10-13
SHENZHEN XINYICHANG AUTOMATIC EQUIP
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Problems solved by technology
At present, there is no equipment on the market specifically for refilling super large substrates
Method used
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[0069] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.
[0070] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. When a component is referred to as being "electrically connected" to another component, it may be a conductive electrical connection, a radio connection, or any other connection capable of transmitting electric...
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The invention provides a crystal supplementing device for an ultra-large substrate. The device comprises a conveying platform used for conveying the ultra-large substrate to pass through an adhesive dispensing station and a crystal filling station in sequence, an adhesive dispensing mechanism which is arranged at the adhesive dispensing station, is positioned on the top side of the conveying platform and is used for supplementing adhesive to the wafer lacking position of the ultra-large substrate; a wafer filling mechanism which is arranged at the wafer filling station, is positioned on the top side of the conveying platform and is used for grabbing wafers and loading the wafers at the wafer lacking position of the ultra-large substrate; and a wafer supply mechanism which is used for storing the wafers and conveying the wafers to the wafer filling station. According to the crystal supplementing device for the ultra-large substrate provided by the invention, the ultra-large substrate isconveyed through the conveying platform; the adhesive dispensing mechanism is used for supplementing the adhesive to the wafer lacking position of the ultra-large substrate; the wafers are provided for the wafer filling mechanism through the wafer supply mechanism, the wafers are grabbed through the wafer filling mechanism and loaded in the wafer lacking position of the ultra-large substrate, sothat the wafer supplementing operation of the ultra-large substrate is independently completed, and the technical blank that no special wafer supplementing equipment for the ultra-large substrate exists in the market at present is filled.
Description
technical field [0001] The application belongs to the technical field of LED packaging, and more specifically, relates to a super large substrate chip replenishment device. Background technique [0002] The process of LED packaging generally requires a die-bonding process. Die Bonding is also called Die Bond or chip loading, that is, the chip is bonded to the designated area of the substrate through colloid (conductive glue, insulating glue or solder paste) to form a thermal path or electrical connection. Passage, a process that provides conditions for subsequent wire bonding connections. Refilling refers to the process of filling glue and filling wafers in the leaky die-bonding area of the substrate. [0003] With the development of LED display technology and the improvement of people's living standards, large-size LED displays are more and more popular in the market; and the production of large-size LED displays requires super-large substrates. Currently, there is no...
Claims
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IPC IPC(8): H01L21/67H01L33/48B05C5/02B05C13/02
CPCB05C5/0208B05C13/02H01L21/67121H01L33/48
Inventor胡新荣
OwnerSHENZHEN XINYICHANG AUTOMATIC EQUIP