Flexible display module, under-screen fingerprint display device and manufacturing method

A flexible display and manufacturing method technology, which is applied in the directions of identification device, character and pattern recognition, cooling/ventilation/heating transformation, etc., and can solve the problems of large stress at the opening, increased stress, fingerprint hole imprinting, etc.

Pending Publication Date: 2020-10-16
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the through-hole design of the heat dissipation film will cause excessive stress at the opening, and because there is a step difference between the light-shielding tape and the heat-dissipating film at this position, the light-shielding tape will generate a lot of pressure o

Method used

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  • Flexible display module, under-screen fingerprint display device and manufacturing method
  • Flexible display module, under-screen fingerprint display device and manufacturing method
  • Flexible display module, under-screen fingerprint display device and manufacturing method

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Embodiment Construction

[0050] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0051]It should be noted that "on", "formed on" and "arranged on" mentioned in this article may mean that one layer is directly formed or set on another layer, or that a A layer is indirectly formed or disposed on another layer, ie there are other layers between the two layers. In this document, unless otherwise specified, the term "on the same layer" used means that two layers, parts, members, elements or parts can be formed by the same patterning process, and that the two layers, parts, members, Elements or parts are ge...

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PUM

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Abstract

The invention discloses a flexible display module, an under-screen fingerprint display device and a manufacturing method. The flexible display module comprises a display panel, a heat dissipation filmand a shading adhesive tape, wherein the heat dissipation film comprises a first film layer, a second film layer and a protective film layer which are sequentially stacked on the side, away from thelight emitting side, of the display panel, the first film layer comprises a first open hole penetrating through the first film layer, and the first open hole corresponds to a sensing area of a fingerprint recognition module to be installed of the flexible display module; the second film layer comprises a second open pore penetrating through the second film layer, the second open pore and the firstopen pore are correspondingly arranged to expose the induction area of the fingerprint recognition module to be installed, and the aperture of the second open pore is larger than that of the first open pore; the protective film covers the second film layer; the shading adhesive tape is arranged on the side, close to the display panel, of the protective film layer and located in the second open hole, and the orthographic projection of the shading adhesive tape on the display panel covers the orthographic projection of the first open hole on the display panel. According to the invention, the mold marks at the opening of the display panel can be effectively reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible display module, an under-screen fingerprint display device and a manufacturing method. Background technique [0002] At present, under-display fingerprints have been widely used in flexible display modules. In the prior art, this design needs to open a hole in the heat dissipation film, and a black light-shielding tape is usually placed above the through hole to protect the part of the display panel that is not covered by the heat dissipation film, thereby eliminating the display. Due to the fact that the through hole corresponding to the panel is not covered by the heat dissipation film, the position exposed to ambient light and the position around the through hole not exposed to ambient light form a difference in display effect, resulting in poor display. However, the through-hole design of the heat dissipation film will cause excessive stress at the opening, and be...

Claims

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Application Information

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IPC IPC(8): G09F9/30H05K7/20G06K9/00
CPCG09F9/301H05K7/20954G06V40/13
Inventor 孙浩高亮杨恩建张爽杨虎飞王东王彬李非凡黄小霞都阿娟蒲世民
Owner BOE TECH GRP CO LTD
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