Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor process equipment and wafer pushing device

A process equipment, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc., can solve problems such as the work efficiency of fragile wafers, and achieve the effect of improving the efficiency of sorting and process efficiency

Pending Publication Date: 2021-02-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the existing methods, the present application proposes a semiconductor process equipment and a chip pushing device to solve the technical problems of the prior art that the wafers are easily damaged and the work efficiency is low in the process of arranging the wafers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor process equipment and wafer pushing device
  • Semiconductor process equipment and wafer pushing device
  • Semiconductor process equipment and wafer pushing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0026] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides semiconductor process equipment and a wafer pushing device. The wafer pushing device is arranged on a wafer box transmission station preset in the semiconductor process equipment and comprises a driving structure and a rotating structure connected with the driving structure, the rotating structure comprises a push plate, and the driving structure is fixedlyarranged on the wafer box conveying station and used for driving the rotating structure to rotate so as to enable the push plate to move to a first position; when the push plate is located at the first position and the wafer box is located at the wafer box conveying station, the push plate can reset the multiple to-be-machined workpieces which are not reset in the wafer box at the same time. According to the embodiment of the invention, a plurality of to-be-processed workpieces which are not reset in the wafer box can be reset at one time, so that the sorting efficiency of the to-be-processedworkpieces is greatly improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment and a chip pushing device. Background technique [0002] At present, vertical furnace equipment is used as the front-end process equipment in the semiconductor manufacturing process. The vertical furnace equipment mainly performs heat treatment processes such as oxide film, annealing, and low pressure chemical vapor deposition (Low Pressure Chemical Vapor Deposition, LPCVD). At present, the mainstream vertical furnace equipment on the market is generally 8-inch wafer vertical furnace equipment and 12-inch wafer vertical furnace equipment. Among them, the wafer storage box used in the 8-inch wafer vertical furnace equipment is called a wafer cassette (Wafer Cassette), which is different from the 12-inch wafer storage box. The wafer cassette is an open storage box, that is, the front ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/677
CPCH01L21/67766H01L21/67781
Inventor 宋新丰
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com