Multi-station slicing machine

Abstract

The invention discloses a multi-station slicing machine. The multi-station slicing machine comprises at least two cutting area assemblies used for slicing and a liquid path assembly used for providingcutting liquid and cooling liquid, and the multiple cutting area assemblies share the liquid path assembly. The multi-station slicing machine has the following beneficial effects that by arranging the multiple cutting area assemblies, namely a plurality of cutting areas, the cutting capacity of the slicing machine can be improved by more than one time, the capacity is improved, the capacity per unit area is doubled, and the utilization rate of plant space can be improved; and meanwhile, the liquid path assembly and an oil gas assembly are arranged to be matched with the cutting area assemblies to complete cutting, and efficient and high-quality hard and brittle material cutting can be achieved.

Description

technical field

[0001] The invention belongs to the field of silicon rod slicing, in particular to a multi-station slicing machine. Background technique

[0002] Silicon wafer forming refers to the process of making silicon rods into silicon wafers. At present, the multi-wire cutting method is the most common method for slicing. In the actual production process, the slicer often has only one cutting area assembly, that is, one cutting area, and one cutting area can only form one cutting station, which results in a cutting cycle that can only be used for hard and brittle materials on a single cutting station. Cutting severely limits the cutting capacity and efficiency of the slicer; increasing the number of slicers to improve the cutting capacity and efficiency will also bring about the problem of occupying more plant land. Many companies cannot achieve this because they cannot expand the plant area. Expand the production scale; increasing the number of slicers also means in...

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