A Method for Enhancing Infrared Thermal Images by Improving GAN

A technology of infrared image and infrared heat, applied in the field of image processing, can solve problems such as difficult to establish a generalization performance model, difficult to establish an accurate model, etc., to achieve the effect of reducing generalization error, improving performance, and eliminating redundant information

Active Publication Date: 2022-04-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

[0010] The challenge of crack detection in thermal imaging detection technology is that due to various and dynamic influencing factors, it is difficult to establish an accurate model related to the physical process, and due to the existence of noise, it is difficult to establish a model with good generalization performance

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  • A Method for Enhancing Infrared Thermal Images by Improving GAN
  • A Method for Enhancing Infrared Thermal Images by Improving GAN
  • A Method for Enhancing Infrared Thermal Images by Improving GAN

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Embodiment

[0066] figure 1 It is a flowchart of a method for enhancing infrared thermal images by improving GAN in the present invention.

[0067] In this example, if figure 1 Shown, the present invention a kind of method by improving GAN enhanced infrared thermal image, comprises the following steps:

[0068] S1. Acquiring an infrared thermal image sequence;

[0069] Use the pulsed eddy current thermal imaging non-destructive testing platform to heat the test piece with known defects at room temperature, and collect P frames of infrared thermal images during the entire heating stage to form an infrared image time sequence S, where the size of each frame of infrared thermal images It is M×N, M and N are the length and width of the infrared thermal image respectively;

[0070] S2, principal component analysis;

[0071] S2.1. In the infrared image time data sequence S, arbitrarily set a pixel point as the target point, extract the temperature-time data of a total of 9 pixel points of t...

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Abstract

The invention discloses a method for enhancing infrared thermal images by improving GAN. Firstly, principal component analysis is performed on any target point of the collected infrared thermal image sequence and 9 pixel points in 8 neighborhoods around it, and the first Principal component component; in order to reduce data redundancy and improve computational efficiency, the first principal component component is sampled and used as a training set together with the processed single binary image; then by fusing the pixels in the adjacent domain, Obtain more thermal time-series signals and their binary pixels to expand the training set data; finally use the thermal image temperature-time series training to improve the GAN model, and perform image enhancement processing on the infrared thermal image through the improved GAN model, effectively improving the defect area and The contrast between the background regions completes the reconstruction of the infrared thermal image.

Description

technical field [0001] The invention belongs to the technical field of image processing, and more specifically relates to a method for enhancing infrared thermal images by improving a generative confrontation network (GAN). Background technique [0002] Crack detection plays an extremely important role in preventing occasional dangerous events caused by crack-defective facilities. With the rapid development of modern industrial technology, industrial facilities and equipment are gradually developing towards high precision, which also has extremely high requirements on the safety of components. The appearance and expansion of cracks will not only seriously affect the performance of facilities and equipment, To a certain extent, it may even lead to the fracture of the components, causing safety problems of the facility, resulting in extremely serious consequences. Therefore it is necessary to detect cracks in industrial components at an early stage. [0003] The current non-...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/62G01J5/00G01N25/72G06N3/04G06N3/08G06V10/77G06V10/774G06V10/80G06V10/30
CPCG01N25/72G01J5/00G06N3/04G06N3/08G01J2005/0077G06V10/30G06F18/2135G06F18/25G06F18/214
Inventor 田露露白利兵杨扬程玉华张杰周权陈聪
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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