Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing equipment with good dustproof effect for semiconductor device manufacturing

A technology for processing equipment and semiconductors, which is applied in semiconductor/solid-state device manufacturing, electrical components, cleaning methods and appliances, etc., and can solve problems such as poor dustproof effect

Inactive Publication Date: 2021-05-18
泗阳垠创运营管理有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a processing equipment for semiconductor device manufacturing with good dust-proof effect, to solve the problem of poor dust-proof effect of traditional semiconductor device manufacturing processing equipment proposed in the above-mentioned background technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing equipment with good dustproof effect for semiconductor device manufacturing
  • Processing equipment with good dustproof effect for semiconductor device manufacturing
  • Processing equipment with good dustproof effect for semiconductor device manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-8 , an embodiment provided by the present invention:

[0031]A kind of processing equipment for the manufacture of semiconductor devices with good dustproof effect, comprising a support plate 1, a support frame 2 is bolted to the front and back of the top of the support plate 1, a processing box 3 is bolted to the top of the support frame 2, and the processing box 3 The inner cavity of the processing box 3 is provided with a dust-proof me...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses processing equipment with good dustproof effect for semiconductor device manufacturing. The equipment comprises a supporting plate, supporting frames are bolted to the front surface and the back surface of the top of the supporting plate, a processing box is bolted to the tops of the supporting frames, a dustproof mechanism is arranged in an inner cavity of the processing box, and a dust collection mechanism matched with the dustproof mechanism for use is arranged at the top of the inner cavity of the processing box. According to the equipment, through cooperation of a first air pump, a hose, a second motor, a driving gear, a first driven gear, a second driven gear, fixing pipes, a connecting pipe, a U-shaped pipe and a nozzle, a user can conveniently use the second motor to drive the two groups of the fixing pipes to rotate at the same time, so that the inner cavity of the processing box is blown in all directions through the rotating nozzle, furthermore, dust in the processing box is always in a floating state, and through cooperation of a second air pump, a ventilation pipe, a flow dividing pipe, a diffusion pipe, a pipeline and suction heads, the user can conveniently use the second air pump to drive the multiple suction heads to rapidly absorb the floating dust.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a processing equipment for manufacturing semiconductor devices with good dust-proof effect. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor of semiconductor devices The material is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. The basic structure of most two-terminal devices (ie, crystal diodes) is a PN junction. [0003] As the demand for semiconductor devices continues to increase, users need to use processing equipment to process semiconductor devi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B08B5/02B08B5/04B01D46/10H01L21/67
CPCB01D46/10B08B5/02B08B5/04H01L21/67028
Inventor 金安年
Owner 泗阳垠创运营管理有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products