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A kind of antenna component and mobile terminal

An antenna component and antenna technology, which is applied to antenna components, antennas, antenna grounding devices, etc., can solve the problems of poor PIM performance at the connection point, and achieve the effects of low interface resistivity, simple combination, and low cost

Active Publication Date: 2022-06-07
南京恩微信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the first aspect of the present application is to solve the technical problem of poor PIM performance at the connection point of two different metals involved in the antenna in the prior art

Method used

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  • A kind of antenna component and mobile terminal
  • A kind of antenna component and mobile terminal
  • A kind of antenna component and mobile terminal

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] In the first embodiment, in the antenna grounding point in the antenna assembly, the universal ultra-low resistance enhancement film needs to be hot-pressed on the metal middle frame or metal middle plate (ie, the lower structural member) of the mobile terminal, so as to realize the contact of the antenna. interconnection of points. Among them, the material of the upper structural member of the universal ultra-low resistance enhancement film is selected as copper with gold plating on the surface, and the universal conductive adhesive applied on the surface of the upper structural member is required not to bring a large resistivity, and the lower the resistivity is. The better, the stronger the PIM performance, the better, and the universal conductive adhesive is required to be resistant to high temperature and have strong bonding force.

[0085]The mass percentage of each component in the universal conductive adhesive is: the mass percentage of the resin matrix is ​​70%...

Embodiment 2

[0094] The difference between the second embodiment and the first embodiment is that different hot pressing conditions are used in this embodiment than those in the first embodiment. In this embodiment, the first preset condition is: the pressure is 80N and the temperature is 90°C for 10s. The second preset condition is: keeping the pressure at 150N and the temperature at 200°C for 60s. The resulting resistivity is 12-24 milliohms.

[0095] In other embodiments, the hot pressing conditions can be changed, the structure, material, size and content of the conductive particles can be changed, and the material, size and content of the conductive filler can be changed, and the material of the resin matrix can also be changed. Resistivity, the lowest resistivity can reach 1-2 milliohms, and the change in resistivity will also bring about changes in PIM performance. It is not repeated here.

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Abstract

The invention provides an antenna component and a mobile terminal. The antenna assembly includes an antenna grounding point, and the antenna grounding point includes: a lower structural member; a universal ultra-low resistance enhancement film, which is hot-pressed on the lower structural member, and the universal ultra-low resistance enhancement film is formed by the upper structural member And the composition of the universal conductive adhesive formed on the upper structural member, the universal conductive adhesive bonds the lower structural member under the condition of the hot pressing, and at least pierces the oxide layer on the surface of the lower structural member, And a surface conduction is formed at the connection interface between the upper structural member and the lower structural member, so as to realize the universal electrical conduction of the universal conductive adhesive. The antenna assembly of the present invention hot-presses the universal ultra-low resistance enhanced film on the lower structural member, so that the interface resistivity between the upper and lower structural members is very low, and the PIM performance of the antenna assembly is very high, and in extremely bad conditions The lower resistivity can still be kept very low, and the combination of the two is very strong, and unexpected technical effects have been obtained.

Description

technical field [0001] The present invention relates to the field of communication technologies, and in particular, to an antenna assembly and a mobile terminal. Background technique [0002] With the rapid development of communication technology, especially 5G antennas, the increase of communication frequency, and the increase of voice and data signal capacity, the factors that had little impact on the signal before have also been paid more and more attention. Passive Intermodulation (Passive Intermodulation) -Modulatio, PIM) is one of the key indicators. PIM can occur at any junction or interface of two dissimilar metals, such as the junction of an antenna and an antenna feed, etc. [0003] There are many factors that affect the performance of PIM. According to the test, the most important requirement is gold-to-gold contact. Secondly, the resistivity at the connection point of two different metals is an important factor. The lower the resistivity, the better the PIM perf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/36H01Q1/48H01Q1/24
CPCH01Q1/36H01Q1/48H01Q1/243
Inventor 崔馨方
Owner 南京恩微信息科技有限公司
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