Automatic keyboard laminating equipment

A kind of laminating equipment and automatic technology, applied in the direction of mechanical equipment, material gluing, connecting components, etc., can solve the problems affecting the quality stability of semi-finished products, difficult to guarantee lamination accuracy, and high labor intensity, so as to reduce labor intensity and reduce labor costs. cost, improve production efficiency, and ensure the effect of stability

Pending Publication Date: 2021-09-03
苏州邦冠自动化设备有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The above-mentioned production method has the disadvantages of high labor intensity and low efficiency, and it is difficult to guarantee the lamination accuracy, which affects the stability of the semi-finished product quality

Method used

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  • Automatic keyboard laminating equipment
  • Automatic keyboard laminating equipment
  • Automatic keyboard laminating equipment

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Embodiment Construction

[0033] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0034] Such as Figure 1-2 As shown, the present embodiment provides a keyboard automatic bonding equipment, including a frame 1, the frame 1 is welded by an internal square tube frame and an external sheet metal shell, and the frame 1 is provided with a turntable component 2, The turntable part 2 is provided with a plurality of carriers 3 for placing substrates and circuit chips, and the outer circumference of the turntable part 2 is sequentially provided with a pressure-sensitive adhesive bin 4, a lower tearing film mechanism 5, a CCD alignment mechanism 6, Mechanical arm 7, upper film tearing mechanism 8 and transplanting pressing mechanism 9;

[0035] In...

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Abstract

The invention relates to automatic keyboard laminating equipment which comprises a rack, a turntable component is arranged on the rack, a plurality of carriers for placing substrates and circuit wafers are arranged on the turntable component, a pressure-sensitive adhesive bin, a lower film tearing mechanism, a CCD alignment mechanism, a mechanical arm, an upper film tearing mechanism and a transplanting and pressing mechanism are sequentially arranged on the periphery of the turntable component in the anticlockwise direction; and the transplanting and pressing mechanism comprises a supporting base fixed to the rack, an X-direction transplanting module arranged in the middle of the supporting base, a first suction assembly connected with the X-direction transplanting module, a supporting wedge plate arranged at the bottom of the supporting base, a pressing air cylinder arranged at the top of the supporting base and a pressing plate arranged between the pressing air cylinder and the supporting wedge plate. According to the automatic keyboard laminating equipment, the laminating operation of a keyboard can be automatically carried out, and the production efficiency is improved while the manual labor intensity and the cost are reduced; and the attaching positions of the substrates and the circuit wafers are accurate, the pressing force is consistent, and the stability of the quality of a keyboard finished product is guaranteed.

Description

technical field [0001] The invention relates to the technical field of keyboard assembly, in particular to a keyboard automatic bonding equipment. Background technique [0002] At present, two small semi-automatic lamination machines are mainly used for the lamination of the metal substrate, pressure-sensitive adhesive and plastic film circuit of the keyboard, and two people are required to operate separately. The specific process is as follows: first tear off the lower protective film of the pressure-sensitive adhesive and attach it to the position of the space bar, then tear off the upper protective film of the pressure-sensitive adhesive, then attach the metal substrate to the plastic film circuit chip, and finally use the cylinder to The metal substrate and the plastic film circuit sheet are pressed together, and after holding the pressure for 5-10 seconds, the finished keyboard is obtained. [0003] The above-mentioned production method has the disadvantages of high ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 李杰
Owner 苏州邦冠自动化设备有限公司
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