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Mounting structure, receiver assembly and terminal equipment

A technology for installation structure and terminal equipment, which is applied in the direction of telephone structure, digital data processing parts, instruments, etc., can solve the problems of poor heat dissipation of functional components, affecting user experience, unfavorable heat dissipation of the whole machine, and increased heat generation.

Pending Publication Date: 2022-05-13
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in order to improve the call quality, the volume of the handset device in the mobile phone is increased, and the heat generated by the handset device is also increased when it is working. While affecting the user experience, it is also not conducive to the heat dissipation of the whole machine.
[0003] For single functional components such as earpiece devices, due to their simple structure, the related technologies generally do not take measures to improve their heat dissipation, so there is a problem in the related technologies that the poor heat dissipation of functional components affects the user experience

Method used

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  • Mounting structure, receiver assembly and terminal equipment
  • Mounting structure, receiver assembly and terminal equipment
  • Mounting structure, receiver assembly and terminal equipment

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Embodiment Construction

[0032] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0033] In related technologies, single functional components such as earpiece devices generally do not take measures to improve heat dissipation due to their simple structure. Therefore, there is a problem in related technologies that poor heat dissipation of functional components affects user experience.

[0034] For example, if figure 1 As shown, in the handset solution of the related art, mo...

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Abstract

The invention relates to a mounting structure, a receiver assembly and terminal equipment. The installation structure comprises a conduction assembly. The conduction assembly comprises a conduction part and an extension part, and the conduction part is connected with the extension part; the conduction part abuts against a preset element of the terminal equipment and is used for pressing the preset element at a preset position of the terminal equipment, and the conduction part is used for conducting heat of the preset element to the extension part. According to the mounting structure disclosed by the invention, the conduction assembly is arranged to effectively dissipate heat of the preset element. The preset element can be a receiver, and the conduction part abuts against the preset element, so that the conduction part can transmit heat of the preset element to the extension part, and uniform heating or heat dissipation of the preset element such as the receiver is achieved.

Description

technical field [0001] The present disclosure relates to the field of terminals, and in particular to an installation structure, a handset assembly and a terminal device. Background technique [0002] With the advancement of technology, iterative updates of smartphones are getting faster and faster. In order to better meet the needs of users for different application scenarios, the power consumption and heat generation of some functional components inside the mobile phone are increasing accordingly. For example, in order to improve the call quality, the volume of the handset device in the mobile phone is increased, and the heat generated by the handset device is also increased when it is working. While affecting the user experience, it is also not conducive to the heat dissipation of the whole machine. [0003] For a single functional component such as an earpiece device, due to its simple structure, no measures are generally taken to improve its heat dissipation in the rel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H04M1/03
CPCG06F1/203H04M1/03
Inventor 陈世平
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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