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Thick plate myriawatt-level fiber laser perforation method

A fiber laser and laser technology, applied in laser welding equipment, manufacturing tools, welding equipment, etc., can solve the problems of poor quality and low laser drilling efficiency, and achieve the goal of improving drilling quality, ensuring drilling quality, and reducing spatter Effect

Pending Publication Date: 2022-08-09
西北工业大学太仓长三角研究院
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Problems solved by technology

[0010] The invention solves the problems of low efficiency and poor quality of laser drilling in the previous process of laser cutting of 10,000-watt-level optical fiber for thick plates, and provides a 10,000-watt-level optical fiber for thick plates that improves the quality and efficiency of high-power laser drilling. laser perforation method

Method used

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  • Thick plate myriawatt-level fiber laser perforation method

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Embodiment Construction

[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] combined with figure 1 , a 10,000-watt fiber laser perforation method for thick plates, including a conventional cutting machine installed on a cutting platform, including the following steps:

[0024] S1, an optical control module is added to the conventional cutting, and the optical module includes a punching focusing mirror module and a cutting focusing mirror module;

[0025] S2. Place the workpiece to be cut on the cutting platform, and select the punching focusing lens module;

[0026] S3. Set the hole parameters of the punching focusing mirror module, such as laser power, pulse form, and light output time;

[0027] S4. Turn on the laser and implement punching;

[0028] S5. Use the control system of the conventional cutting machine, switch the punching focusing mirror module, and implement the cutting.

[0029] Further, the laser is one of a ...

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Abstract

The invention relates to a thick plate myriawatt-level fiber laser perforation method, which comprises a conventional cutting machine mounted on a cutting platform, and comprises the following steps: S1, an optical control module is added on the conventional cutting, and the optical control module comprises a perforation focus lens module and a cutting focus lens module; s2, a workpiece to be cut is placed on a cutting platform, and a punching focus lens module is selected; s3, setting hole parameters of the punching focus lens module, such as laser power, pulse form and light emitting time; s4, a punching focus lens module is opened, and punching is carried out; and S5, a control system of a conventional cutting machine is used, a punching focus lens module is switched, and cutting is carried out. The device has the advantages that the optical module is added, the focusing diameter and the Rayleigh length of a laser beam are controlled, and the high-power laser drilling quality and efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a method for perforating a thick plate with a 10,000-watt fiber laser. Background technique [0002] Laser perforation is the pre-process of thick plate laser cutting, and the efficiency and quality of perforation are the key to thick plate laser cutting technology. [0003] Currently known laser perforation methods are as follows: [0004] 1. The Chinese patent is a step perforation system for laser cutting medium and thick plates, the announcement number is CN 202854559 U, and the announcement date is April 3, 2013. During operation, the main parameters of the method continuously change step by step within the perforation time according to a certain law, so as to match the optimal parameters, so as to reduce the perforation time, avoid local overheating, reduce the explosion rate, and avoid damage to the focusing mirror. The penetration of fine pores is completed in ...

Claims

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Application Information

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IPC IPC(8): B23K26/382B23K26/70B23K26/064
CPCB23K26/382B23K26/70B23K26/064Y02P70/10
Inventor 冯杰才郑曦张仕进刘彦杰任子为
Owner 西北工业大学太仓长三角研究院
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