Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

32 results about "Rayleigh length" patented technology

In optics and especially laser science, the Rayleigh length or Rayleigh range, zR, is the distance along the propagation direction of a beam from the waist to the place where the area of the cross section is doubled. A related parameter is the confocal parameter, b, which is twice the Rayleigh length. The Rayleigh length is particularly important when beams are modeled as Gaussian beams.

Method for determining laser defocusing amount in femtosecond laser polishing process of optical element

The invention discloses a method for determining the laser defocusing amount in the femtosecond laser polishing process of an optical element, which belongs to the technical field of mechanical precision manufacturing engineering, and comprises the following steps of: outputting laser wavelength and focusing spot radius by using a femtosecond laser, and calculating Rayleigh length of a light beam;calculating the energy density when the laser reaches the surface of the material by utilizing the output pulse energy of the laser to focus the spot radius and the defocusing amount; calculating theablation depth of the surface of the energy material by using a femtosecond laser ablation rate mathematical model; solving the ablation depth of the femtosecond laser to the material under differentdefocusing amounts according to the laser ablation rate mathematical model; measuring the average value of the surface of the to-be-polished optical element, and determining the optimal polishing defocusing amount by substituting the height difference of the wave crest and the wave trough into calculation. The defocusing amount of femtosecond laser polishing can be rapidly, efficiently and accurately determined, the cost is low, the efficiency is high, and the accuracy is high.
Owner:TIANJIN UNIV

System and method for generating teraHertz wave by using flight focusing

The invention discloses a system and method for generating teraHertz waves by using flight focusing, wherein the system for generating the teraHertz waves by using the flight focusing comprises a chirped signal generating device and a flight focusing device, wherein the chirped signal generating device is used for generating chirped laser pulse; the flight focusing device uses a diffraction element for focusing the chirped laser pulse so as to stimulate and generate air plasma and to further generate the teraHertz waves. The chirped laser pulse and the diffraction element are combined by the system and method for generating teraHertz waves by using flight focusing provided by the invention, so that the moving speed of the peak value intensity of the laser focus point region is controlled;the propagation of the laser light beams in the focusing regions can be controlled; in addition, the propagation length is many times of the Rayleigh length. Compared with the existing method for generating the teraHertz waves by the air, the method provided by the invention has the advantages that the intensity of the teraHertz waves generated by the method is greatly enhanced; the blank in the technical field of the existing high-intensity teraHertz wave generation is filled; high scientific research and practical application values are realized.
Owner:CAPITAL NORMAL UNIVERSITY

Piercing processing method and laser processing machine

A piercing processing method and a laser processing machine capable of carrying out a piercing processing on a thick plate in short time are provided. It is a processing method for carrying out a piercing processing on a metallic material by laser beams with wavelengths in 1 μm band, where the piercing processing is carried out by maintaining a range of 8≦Zr / d≦12 when a condensed beam diameter of the laser beams is set to be d and a Rayleigh length of the laser beams is set to be Zr. At that time, a focal position of the laser beams is set to be on a surface of a workpiece or an external of the workpiece. Then, a beam profile of the laser beams is such that the laser beams of a single mode are converted into a bowler hat shape by a beam quality tunable device.
Owner:AMADA HLDG CO LTD

Apparatus And Method For Laser Processing A Material

ActiveUS20210031303A1Avoiding unintentional mode couplingStable optical mode outputAdditive manufacturing apparatusIncreasing energy efficiencyLaser processingRayleigh length
Apparatus for laser processing a material (11), which apparatus comprises an optical fibre (2), at least one squeezing mechanism (3), and a lens (4), wherein: the optical fibre (2) is a multimode optical fibre; the optical fibre (2) is such that laser radiation (13) is able to propagate along the optical fibre (2) in a first optical mode (21) and in a second optical mode (22); the squeezing mechanism (3) comprises at least one periodic surface (6) defined by a pitch (7); and the periodic surface (6) is located adjacent to the optical fibre (2); and the apparatus is characterized in that: the pitch (7) couples the first optical mode (21) and the second optical mode C(22) together; the first optical mode (21) is defined by a first mode order (24), and the second optical mode (22) is defined by a second O mode order (25) which is higher than the first mode order (24); the squeezing mechanism (3) is configured to squeeze the periodic surface (6) and the optical fibre (2) together with a squeezing force (12), thereby coupling the first optical mode (21) to the second optical mode (22); the lens (4) is defined by a front focal plane (14) and a rear focal plane (15); the first optical mode (21) is defined by a Rayleigh length (217); and the lens (4) is located within two of the Rayleigh lengths (217) from the distal end (16) of the optical fibre (2).
Owner:TRUMPF LASER UK LTD

Thick plate myriawatt-level fiber laser perforation method

The invention relates to a thick plate myriawatt-level fiber laser perforation method, which comprises a conventional cutting machine mounted on a cutting platform, and comprises the following steps: S1, an optical control module is added on the conventional cutting, and the optical control module comprises a perforation focus lens module and a cutting focus lens module; s2, a workpiece to be cut is placed on a cutting platform, and a punching focus lens module is selected; s3, setting hole parameters of the punching focus lens module, such as laser power, pulse form and light emitting time; s4, a punching focus lens module is opened, and punching is carried out; and S5, a control system of a conventional cutting machine is used, a punching focus lens module is switched, and cutting is carried out. The device has the advantages that the optical module is added, the focusing diameter and the Rayleigh length of a laser beam are controlled, and the high-power laser drilling quality and efficiency are improved.
Owner:西北工业大学太仓长三角研究院

Piercing method and laser processing apparatus

ActiveCN107000121AEffective through processingLaser beam welding apparatusLaser processingThick plate
Provided are a piercing method and a laser processing apparatus (1) that can perform a piercing process on a thick plate within a short period of time. In a processing method for performing a piercing process on a metallic material (W) by using laser light with a wavelength in the 1 micrometer band, when the focal beam diameter of the laser light is defined as d and the Rayleigh length is defined as Zr, the piercing process is performed while 8 <= Zr / d <= 12 is maintained. The focal position of the laser light is set to the surface of a workpiece (W) or the outside of the workpiece (W). With regard to the beam profile of the laser light, single-mode laser light is transformed into a bowler-hat shape by a beam-quality tunable device (13).
Owner:AMADA HLDG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products