The invention relates to a
thick plate myriawatt-level
fiber laser perforation method, which comprises a conventional
cutting machine mounted on a
cutting platform, and comprises the following steps: S1, an
optical control module is added on the conventional
cutting, and the
optical control module comprises a perforation focus lens module and a cutting focus lens module; s2, a workpiece to be
cut is placed on a cutting platform, and a
punching focus lens module is selected; s3, setting hole parameters of the
punching focus lens module, such as
laser power, pulse form and light emitting time; s4, a
punching focus lens module is opened, and punching is carried out; and S5, a
control system of a conventional cutting
machine is used, a punching focus lens module is switched, and cutting is carried out. The device has the advantages that the
optical module is added, the focusing
diameter and the
Rayleigh length of a
laser beam are controlled, and the high-power
laser drilling quality and efficiency are improved.