Ultrasonic scroll saw cutting process for non-conductive hard fragile material

A hard and brittle material, ultrasonic vibration technology, applied in the direction of stone processing equipment, manufacturing tools, fine working devices, etc., can solve the problems of high wire wear rate, low cutting efficiency, and inability to fully exert the performance of superhard abrasives, etc., to achieve High-efficiency precision cutting technology, the effect of improving cutting accuracy

Inactive Publication Date: 2006-11-08
SHANDONG UNIV
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Problems solved by technology

The main problem of this method is that the cutting efficiency is low. For crystal materials with high hardness, such as SiC single crystal, sapphire crystal, etc., the wear rate of the saw wire is even higher than the removal rate of the material to be cut, and the cutting efficiency of the saw wire cannot be fully utilized. The properties of diamond and other superabrasives

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  • Ultrasonic scroll saw cutting process for non-conductive hard fragile material
  • Ultrasonic scroll saw cutting process for non-conductive hard fragile material

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Embodiment Construction

[0011] The method of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0012] The basic working principle of the existing free abrasive saw wire multi-wire slicing technology is as follows: figure 1 As shown, the workbench (not shown in the figure) is above, the ingot 4 is fixed on the workbench by the clamp 5, the saw wire 1 is wound on the leading roller 2, and the abrasive liquid is sprayed out from the nozzle 3, and the saw wire 1 is in the Driven by the driving mechanism, the cutting crystal bar 4 is moved, and multiple crystals can be cut at one time. This method has low cutting efficiency, and for crystal materials with higher hardness, such as SiC single crystal, sapphire crystal, etc., the wear rate of the saw wire is even higher than the removal rate of the cut material.

[0013] The cutting principle of the non-conductive hard and brittle material ultrasonic vibration compound wire saw cutting met...

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Abstract

The present invention discloses ultrasonic scroll saw cutting process for non-conductive hard fragile material. During cutting of the non-conductive hard fragile material, the sawing wire moves in single way or reciprocally to perform the main cutting while moving in the direction perpendicular to the main cutting motion direction to realize feeding. In the same time, ultrasonic vibration is applied for the non-conductive hard fragile material to vibrate in at least one directions of the main cutting direction and the feeding direction. The present invention has raised cutting efficiency and high cutting precision.

Description

technical field [0001] The invention relates to a cutting method for non-conductive hard and brittle materials, and belongs to the technical field of cutting non-conductive hard and brittle materials. Background technique [0002] Monocrystalline silicon, polycrystalline silicon, quartz crystal, SiC single crystal, sapphire crystal and other valuable non-conductive hard and brittle materials are widely used in the fields of integrated circuits (IC), solar cells and optoelectronics. With the continuous development of modern technology, the size of the above-mentioned crystals continues to increase, while the thickness of the wafer tends to become thinner. The increase in crystal size and the decrease in wafer thickness have brought new challenges to the cutting and processing technology of crystal slices. [0003] At present, free abrasive saw wire slicing and fixed abrasive saw wire slicing technologies are mostly used to cut crystal slices, especially the free abrasive mul...

Claims

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Application Information

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IPC IPC(8): B26D1/547B26D7/08B26D7/26B28D5/00
Inventor葛培琪朱振杰高玉飞张磊侯志坚
OwnerSHANDONG UNIV