Heat sink for LED lamp
a technology of led lamps and sinks, which is applied in the direction of lighting and heating apparatus, semiconductor devices of light sources, laminated elements, etc., can solve the problems of reducing work efficiency and service life, difficult to dissipate a large amount of heat accumulating in the bottom portion, and led lamps arranged side-by-side in large density
Inactive Publication Date: 2009-02-19
FU ZHUN PRECISION IND SHENZHEN +1
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Benefits of technology
The patent describes a heat dissipation device for LEDs that helps to spread the heat generated by the LEDs. The device has two heat sinks that are mounted on a circuit board using a heat spreader. Each heat sink has a plurality of fins stacked together and a plurality of short walls formed at its lateral sides. The heat sinks also have openings and cavities that allow airflow. The technical effect of this design is that it helps to efficiently dissipate the heat generated by the LEDs, which can prolong the lifespan of the LEDs and improve their performance.
Problems solved by technology
It is well known that an LED lamp with LEDs arranged side-by-side in large density generates a lot of heat when it emits light.
If the heat cannot be quickly removed, the LED lamp may become overheated, significantly reducing work efficiency and service life thereof.
However, it is difficult to dissipate a large amount of heat accumulating in a bottom portion between the base and the fins, because airflow can not substantially flow through the bottom portion in the natural convection manner.
Method used
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Embodiment Construction
[0013]Referring to FIG. 1, an LED device in accordance with a preferred embodiment of the present invention adapted for a lighting purpose is shown. The LED device comprises an LED module 10 used for emitting light, a heat dissipation device 40 for dissipating heat generated by the LED module 10. The LED module 10 comprises a rectangular circuit board 12 and a plurality of LEDs 15. The LEDs 15 are evenly spaced and electrically mounted on a bottom surface (not labeled) of the circuit board 12. The heat dissipation device 40 comprises a heat spreader 20 and two heat sinks 30 mounted on the heat spreader 20.
[0014]The heat spreader 20 is rectangular and made of metal such as aluminum, copper or alloy thereof, which has a good thermal conductivity. The LED module 10 is attached to a bottom portion 220 of the heat spreader 20. The two heat sinks 30 are attached to a top portion 222 of the heat spreader 20.
[0015]Referring to FIG. 2, each of the heat sinks 30 is formed by folding a metal s...
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A heat dissipation device (40) is used for dissipating heat generated by a plurality of LEDs (15) mounted on a circuit board (12). The heat dissipation device comprises two heat sinks (30) mounted on the circuit board via a heat spreader (20). Each of the two heat sinks comprises a plurality of fins (300) stacked together. A plurality of short walls (350) are formed at two opposite lateral sides of the two heat sinks. A plurality of openings (330) are defined below the short walls and opened laterally. A plurality of vertical cavities (360) are defined by the two heat sinks and communicate with the openings (330), respectively. The cavities in the two heat sinks are alternately arranged.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to a heat sink, and more particularly to a heat sink used for an LED lamp.[0003]2. Description of Related Art[0004]With the continuing development of scientific technology and the raise of people's consciousness of energy saving, LEDs have been widely used in the field of illumination due to their small size and high efficiency. It is well known that an LED lamp with LEDs arranged side-by-side in large density generates a lot of heat when it emits light. If the heat cannot be quickly removed, the LED lamp may become overheated, significantly reducing work efficiency and service life thereof.[0005]A conventional heat sink which is used to absorb heat of the LED device is shown in U.S. Pat. No. 6,517,218. The heat of the LED device is transferred to a base of a heat dissipater at first, and then is dissipated to ambient air in a natural convection manner by fins of the heat dissipat...
Claims
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IPC IPC(8): H05K7/20
CPCF21K9/00F21V29/74F28F3/027
Inventor YU, GUANGLAI, CHENG-TIEN
Owner FU ZHUN PRECISION IND SHENZHEN