LED array grid, method and device for manufacturing said grid and LED component for use in the same

a technology led components, applied in semiconductor devices for light sources, lighting and heating apparatus, lighting support devices, etc., can solve the problem of reducing the cost of led array grids

Inactive Publication Date: 2011-08-25
KONINKLIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach reduces construction costs, enables efficient large area illumination, and results in a durable LED array grid with lower operational costs compared to traditional PCB-based solutions, while allowing for flexible design and application in various lighting applications.

Problems solved by technology

Further, the use of a wire instead of a large area printed circuit board further decreases the cost for the LED array grid.

Method used

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  • LED array grid, method and device for manufacturing said grid and LED component for use in the same
  • LED array grid, method and device for manufacturing said grid and LED component for use in the same
  • LED array grid, method and device for manufacturing said grid and LED component for use in the same

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Experimental program
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Embodiment Construction

0030]FIG. 3a-c are perspective views illustrating the production steps for LED components that are of IDC (insulation displacement connector) type.

[0031]FIG. 4 is a perspective partial view showing details of a device performing the inventive method.

[0032]FIG. 5 is a perspective view from behind of the device of FIG. 4.

[0033]FIG. 6 is a schematic view of an alternative embodiment of the inventive method.

[0034]FIG. 7 is a perspective view of a LED array grid according to one embodiment of the invention arranged between two glass plates.

[0035]FIGS. 8a and 8b are schematic views illustrating the structure of LED components which are adapted for soldered or glued wires as interconnect.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0036]FIG. 1 shows the main steps of the inventive method. It illustrates an example of how LEDs 102 for use in the present invention can be arranged on a PCB 104, see also FIG. 2. The LEDs 102 can be prepackaged LEDs or naked dyes. In this example the PCB 104 i...

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Abstract

Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer >1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates

Description

TECHNICAL FIELD[0001]The present invention relates to a method for production of an illumination system, an illumination system produced with said method, and a winding device.TECHNICAL BACKGROUND[0002]Light emitting diodes (LEDs) have been used as backlight for displays and illumination panels for some time, where a large number of low power LEDs are arranged in an array. LEDs are well suited for this purpose for several reasons. They are, for instance, durable structures with a long lifetime, which reduces the maintenance needed. Also, they have a low power consumption and are operated at lower voltages, which reduces costs of operation and risks related to high voltage applications. In relation to this they have an high light output. Prior art techniques include the arrangement of LEDs on printed circuit boards (PCBs). This is, however a costly solution, especially when the LEDs are on a large pitch an larger areas are to be illuminated.SUMMARY OF THE INVENTION[0003]In order to p...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L33/62H01L27/15H01L33/00H01L33/48
CPCB21F45/00F21K9/00H01L2924/01047H01L2224/48465H01L2224/45147F21Y2101/02F21V21/002F21K9/90F21S4/002F21S4/008H01L2224/48091H01L2924/00014H01L2924/00H01L2924/207F21S4/15F21S4/28F21Y2115/10H01L2224/45015H01L33/62H01L2924/2076H01L2924/0002F21V23/00
InventorWEEKAMP, JOHANNESSLOB, CORNELIS
OwnerKONINKLIJKE PHILIPS NV