Heat dissipation apparatus
a heat dissipation apparatus and heat dissipation technology, which is applied in the direction of electrical apparatus, light and heating apparatus, basic electric elements, etc., can solve the problems of limited heat dissipation efficiency failure of heat dissipation apparatus to effectively dissipate heat, etc., and achieve the effect of improving heat dissipation efficiency
Inactive Publication Date: 2018-02-01
ACER INC
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Benefits of technology
The present invention provides a heat dissipation apparatus with improved heat dissipation efficiency. The apparatus has a heat-insulation unit that prevents the working fluid from vaporizing while entering the tank, reducing resistance and improving circulation and heat dissipation efficiency. The heat-insulation nozzle design allows the working fluid to fully disperse in the tank and reduces the occurrence of tank dryness or contact area reduction, maintaining efficiency of heat exchange. Overall, the heat dissipation apparatus ensures sufficient working fluid in the tank and is suitable for high wattage electronic products.
Problems solved by technology
However, when the temperature generated by the heat source is excessively high, the working fluid in the liquid state has been boiled into its gaseous state before flowing back to the tank, which leads to failure in completing the single circulation, so that the heat dissipation apparatus fails in effectively dissipating heat.
Moreover, the working fluid flows in a closed loop composed by the tank and a pipe merely by its phase transformation, which results in unsatisfactory flowing condition, and there may not be sufficient amount of the working fluid to perform such reaction, so the dissipation efficiency of the heat dissipation apparatus is limited.
Method used
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[0022]Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
[0023]FIG. 1A is a schematic top view illustrating a heat dissipation apparatus according an exemplary embodiment of the present invention. FIG. 1B is a three-dimensional schematic view illustrating a tank and a heat-insulation unit of the heat dissipation apparatus shown in FIG. 1A. Please refer to FIG. 1A and FIG. 1B simultaneously, a heat dissipation apparatus 100A of the present exemplary embodiment is suited for dissipating heat of a heat source 10, wherein the heat source 10 is a heat generating device, such as a chip in an electronic apparatus or a processor, or a heat pipe, which is capable of absorbing heat from the other heat generating devices and transmitting heat to the heat dissipation ...
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A heat dissipation apparatus suited for dissipating heat of a heat source. The heat dissipation apparatus includes a tank, a heat-insulation unit and a pipe. The tank has an outlet end, an inlet end and an accommodating space, wherein the tank receives heat of the heat source from above. The heat-insulation unit is disposed in the accommodating space of the tank, and the heat-insulation unit includes a heat-insulation nozzle. The heat-insulation nozzle has a first opening, a second opening and a neck portion, wherein the first opening communicates with the inlet end, the second opening communicates with the accommodating space and the neck portion is near the second opening. The pipe communicates the outlet end and the inlet end and forms a closed circulating loop with the tank.
Description
CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 105123891, filed on Jul. 28, 2016. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present invention generally relates to a heat dissipation apparatus, in particular, to a heat dissipation apparatus disposed in a portable electronic apparatus.2. Description of Related Art[0003]A single circulation of a general heat dissipation apparatus is referred to disposing a heat source below a tank, after flowing into the tank, a working fluid in a liquid state is heated by the heat source and boiled into its gaseous state, then flows out of the tank. While the working fluid in the gaseous state flows to the condenser, it is condensed to its liquid state again, then flows back to the tank, in order to complete the single circu...
Claims
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IPC IPC(8): F28D15/02
CPCF28D15/0266F28D15/025F28F9/026F28D15/06H01L23/427F28F2270/00
InventorCHENG, CHENG-YULIAO, WEN-NENGHSIEH, CHENG-WENKE, JAU-HANWANG, YUNG-CHIH
OwnerACER INC