System and Method for Making Micro LED Display
a technology of led display panel and led light, applied in the direction of basic electric elements, electrical equipment, semiconductor devices, etc., can solve the problems of short response time, high brightness, and low power consumption
Inactive Publication Date: 2021-05-06
WU BOR JEN +1
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- Description
- Claims
- Application Information
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Benefits of technology
This approach enhances the throughput and makes the mass transfer of micro LEDs industrially and commercially viable, enabling efficient production of micro LED displays by directly transferring micro LEDs to a bonding substrate with integrated driving circuits, thus facilitating mass production.
Problems solved by technology
Advantages of micro LED, inherited from conventional LED, include low power consumption, high brightness, short response time, and long life time.
However, for each single micro LED, conventional manufacturing process can't be adapted in mass production due to millions of micro LEDs in one display are hard to be transferred from substrate to display efficiently; that's the mass transfer issue.
The mass transfer issue still exists that millions of micro LED have to be picked up from bonding substrate to receiving substrate individually; that's too time consuming.
Some other solutions, such as by using fluid filter or drop by gravity force, are still not industrially available.
Method used
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[0055]As used herein, the term “substrate” generally refers to plates formed of a semiconductor or non-semiconductor material. Examples of such a semiconductor or non-semiconductor material include, but are not limited to, monocrystalline silicon, silicon carbide, gallium arsenide, indium phosphide, sapphire, ceramic, glass, and PCB. Such substrates may be commonly found and / or processed in semiconductor fabrication facilities. An epi-substrate refers to a plate provided for epitaxial growth in semiconductor fabrication facilities. A bonding substrate refers to a plate with circuits and bonding pads thereon for receiving electronic devices.
[0056]For the substrate, one or more layers may be formed upon the substrate. Many different types of such layers are known in the art, and the term substrate as used herein is intended to encompass a wafer on which all types of such layers may be formed. One or more layers formed on a substrate may be patterned. For example, a substrate may inclu...
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By using chip-by-chip, mainly separation technology, micro LED can be made very accurately and efficiently. First, after epitaxial process, the LED epi-wafer is processed into micro LEDs. Second, bonding substrates with driving circuits are provided for the LED epi-wafer. Then, each LED chip is fastened to the substrate chip-by-chip simultaneously or sequentially, and each LED chip may be transferred by using separation technology simultaneously or sequentially. The LED epi-wafer per se can be also provided as LED display substrate.
Description
CLAIM OF PRIORITY[0001]This application is a Divisional Application of U.S. patent application Ser. No. 16 / 375,388 filed on Apr. 4, 2019, which is incorporated by reference as if fully set forth herein.FIELD OF THE INVENTION[0002]The invention relates to a micro LED display panel and a method for forming the micro LED display panel. The invention also relates to an apparatus for forming the micro LED panel. However, it would be recognized that the invention has a much broader range of applicability.BACKGROUND OF THE INVENTION[0003]Micro LED, followed conventional TFT LCD display and OLED display, is deemed as a next high technologic display. Advantages of micro LED, inherited from conventional LED, include low power consumption, high brightness, short response time, and long life time. The 55 inch crystal LED TV, assembled by micro LED, is announced and manufactured by Sony in 2012, in which more than six million micro LEDs were used as high resolution pixels with million levels con...
Claims
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IPC IPC(8): H01L27/15H01L33/00H01L33/32H01L33/62H01L33/50H01L33/44
CPCH01L27/156H01L33/007H01L33/32H01L33/62H01L2933/0025H01L33/44H01L2933/0041H01L2933/0066H01L33/50H01L33/0093H01L33/0095H01L25/0753H01L25/167
InventorWU, BOR-JENTSEN, CHIA-BIN
OwnerWU BOR JEN