The utility model relates to the technical field of semiconductors, in particular to a
semiconductor plastic
package mold. Comprising a
machine box, a
machine frame is arranged on the upper surface of the
machine box, a mold frame is slidably connected into the machine frame through a sliding
assembly, a groove used for containing a mold cavity is formed in the upper surface of the mold frame, and fixing assemblies used for stabilizing the mold cavity are arranged on the two sides of the interior of the groove; a control
assembly is arranged in one side of the mold frame, and the side, close to the rack, of the control
assembly is in inserted fit with the inner wall of the rack through a positioning assembly, in the
semiconductor plastic packaging mold, the sliding assembly assists the mold frame in position adjustment and limitation, the position of the mold frame is stabilized through the control assembly and the positioning assembly, and therefore the mold frame is more stable in position. According to the
semiconductor plastic
package mold, the working efficiency of demolding of the semiconductor plastic
package mold is improved, the mold frame can be reset conveniently, time waste is avoided, the practicability of the semiconductor plastic package mold is improved, and therefore economic losses are avoided.