2results about How to "Satisfy Integrity" patented technology

This invention discloses a secure encryption method for the operating system kernel based on the AES algorithm, relating to the fields of operating system security and data encryption technology. The method comprises the following steps: S1, traversing and scanning the data in the operating system kernel, identifying sensitive data, and classifying it according to its sensitivity level; S2, generating an encryption master key and hierarchical subkeys based on the AES algorithm; S3, encrypting data of different sensitivity levels using AES encryption algorithms with different rounds and encryption modes; S4, dynamically updating the key and encrypting and storing the updated key in the kernel secure storage area; S5, adding a checksum to the encrypted sensitive data and verifying data integrity; S6, reading the corresponding key and decrypting the data to complete data access. This invention significantly improves key security and data integrity, effectively balances encryption efficiency and system performance, has strong adaptability and high practicality, and is easy to promote and apply.

The invention discloses a copper deposition process of a DPC deep-hole ceramic substrate, and relates to the technical field of advanced semiconductor packaging, optoelectronic device manufacturing and precision electronic assembly, and the copper deposition process comprises the following steps: carrying out laser drilling on a ceramic substrate in a spiral drilling mode; and then sequentially carrying out porcelain slag cleaning, magnetron sputtering, chemical copper deposition and thick copper electroplating on the ceramic substrate. According to the method, copper can be coated on the inner wall of the deep hole of the ceramic substrate with the hole depth ratio exceeding 5 without depending on ionized physical vapor deposition and atomic layer deposition, the welding requirement and the bonding performance are met, and meanwhile the cost needed by three-dimensional interconnection packaging manufacturing is greatly reduced.