2results about How to "Short wavelength" patented technology

This invention discloses a method for enhancing and controlling the radiation of an LPP-EUV light source based on dual-pulse spatiotemporal co-constraint, belonging to the field of semiconductor manufacturing technology. This invention obtains a spatiotemporal reference by real-time monitoring of a liquid metal droplet, uses a pre-pulse laser to induce target material deformation into a fogged target cloud, and combines high-speed imaging and a hydrodynamic model to predict the time and coordinates of the target cloud's energy absorption peak. It dynamically adjusts the delay time and optical axis direction of the main pulse laser to achieve dual-pulse spatiotemporal co-constraint, and constructs a closed-loop control system through a recursive least squares algorithm with a dynamic forgetting factor. This invention effectively improves the extreme ultraviolet light conversion efficiency, controls the power fluctuation of the light source within ±0.5%, and extends the maintenance cycle of optical components by 2 times. It can be widely applied to next-generation high-power extreme ultraviolet lithography light source systems, meeting the application requirements of semiconductor miniaturization processes.

This invention relates to the field of metal environment imaging, and more particularly to an environmental imaging method and apparatus based on millimeter-wave radar. The method includes the following steps: transmitting multi-frequency signals to the metal environment to be detected using a millimeter-wave radar array, and extracting multipath signal sequences; performing interferometric phase analysis based on the multipath signal sequences to obtain the three-dimensional coordinates of the metal and the actual target reflection point; performing iterative forward calculation based on the three-dimensional coordinates of the metal and the actual target reflection point to obtain a first metal environment image; and performing iterative residual convergence on the first metal environment image to output a second metal environment image. This invention achieves high-precision and reliable three-dimensional imaging of complex metal environments.