Integrated circuit semiconductor device

Abstract

The invention relates to an integrated circuit semiconductor device which comprises a plastic body which is provided with a built-in integrated circuit chip, and the plastic body is equipped with a chip electrode extension end. The integrated circuit semiconductor device is characterized in that: (1) the bottom of the plastic body is equipped with a notch groove which is inserted with a heat emission plate connected with the integrated circuit chip; (2) the plastic body is equipped with a lock screw through hole which vertically intersects with a heat emission plate, an opening is correspondingly arranged on the periphery of the screw through hole on the heat emission plate to prevent the lock screw from contacting with the heat emission plate, and the diameter of the opening is larger than the internal diameter of the screw through hole. The device is helpful for the heat emission of the internal chip of the integrated circuit semiconductor device, and has the advantages of novel design, simple structure, good insulation effect, convenient production, and has great popularization significance.

Description

technical field [0001] The present invention relates to an integrated circuit semiconductor device. technical background [0002] With the continuous improvement of semiconductor manufacturing technology, the processing speed and functional requirements of chips are also increasing. The accompanying problem is how to effectively dissipate the heat generated by chips during operation to ensure the reliability of semiconductor devices. Now, in order to solve the heat dissipation problem of this type of package, the heat dissipation sheet exposed on the bottom surface of the package is often used as a heat dissipation path to dissipate the heat of the chip to the outside. However, since the heat sink will be in contact with the screws used to fix the semiconductor device on the substrate, it is easy to cause a short circuit, so an insulating piece must be added to insulate the heat sink from the screws, which not only increases the process, but also increases the production cos...

AI Technical Summary

Problems solved by technology

However, since the heat sink will be in contact with the screws used to fix the semiconductor device on the substrate, it is easy to cause a short circuit, so an insulating piece must be added to insulate the heat sink from the screws, which not only increases the process, but also increases the production cost. And it makes the installation and operation of semiconductor devices inconvenient

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