Energy-saving lighting device

A lighting device, energy-saving technology, applied in the direction of electrical components, electric solid state devices, circuits, etc., can solve problems such as unfavorable heat dissipation of LED chips, cracking of adhesive layers, and poor edge sealing, so as to facilitate heat dissipation and ensure stability. sexual effect

Active Publication Date: 2018-05-25
浙江绿创新拓建筑规划设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After a long period of bumping, vibration, aging, etc., the adhesive layer of this package will crack, resulting in figure 2 The shown LED chip falls off according to the arrow Q, which will l

Method used

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Examples

Experimental program
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Example

[0016] First embodiment

[0017] See image 3 , The energy-saving lighting device of the present invention includes a heat dissipation base, 1, an LED chip 6, a conductive pattern 5, a first insulating material layer 8 and a transparent conductive layer 9; the heat dissipation substrate 1 has a first conductive pattern 5 Surface and a second surface opposite to the first surface, the LED chip 6 is fixed to the portion of the first surface of the heat dissipation substrate 1 where the conductive pattern 5 is not provided by an adhesive layer (not shown) , And there is a gap between the LED chip 6 and the conductive pattern 5, the heat dissipation substrate 1 is also provided with an extending groove 7 on the first surface, and the conductive pattern 5 is provided with Extend into the corresponding through hole (not shown) of the groove; the first insulating material layer 8 covers the side surface of the LED chip 6 and fills the gap; the transparent conductive layer 9 is electrica...

Example

[0018] Second embodiment

[0019] See Figure 4 The present invention also provides another energy-saving lighting device, which includes a heat dissipation substrate 1, an LED chip, a conductive pattern 5, a second insulating material layer 11 and a bonding wire; the heat dissipation substrate 1 has a first conductive pattern 5 One surface and a second surface opposite to the first surface, the LED chip is fixed to the portion of the first surface of the heat dissipation substrate 1 where the conductive pattern 5 is not provided by an adhesive layer (not shown) , And there is a gap between the LED chip 6 and the conductive pattern 5, the heat dissipation substrate 1 is further provided with an extending groove 10 on the first surface, and the extending groove 10 is arranged in the gap The LED chip includes a light-emitting middle area 61 and a redundant area 62 surrounding the light-emitting area 61, the side of the redundant area 62 is provided with an annular groove 12, the a...

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Abstract

The invention provides an energy-saving lighting device. The device includes a heat dissipation substrate, an LED chip, a conductive pattern, a first insulating material layer and a transparent conductive layer. The heat dissipation substrate has a first surface provided with the conductive pattern and a second surface opposite to the first surface, the LED chip is fixed on the part, not providedwith the conductive pattern, on the first surface of the heat dissipation substrate through a bonding layer, and a gap is formed between the LED chip and the conductive pattern; the heat dissipation substrate is further provided with a stretch-in groove formed in the first surface, and a through hole corresponding to the stretch-in groove is formed in the conductive pattern; the first insulating material layer covers the side face of the LED chip and fills the gap; the transparent conductive layer is electrically connected with an electrode of the LED chip and the conductive pattern, is located on the first insulating material layer and fully fills the stretch-in groove and the through hole.

Description

technical field [0001] The invention relates to the field of LED chip packaging, belongs to the classification number H01L33 / 00, and specifically relates to an energy-saving lighting device. Background technique [0002] LED packages in the prior art can be found in figure 1 An LED chip 6 is fixed on the heat dissipation substrate 1 through the adhesive layer 3, and the electrodes of the LED chip 6 are electrically connected to the conductive pattern 5 through 4, and covered with the phosphor layer 2 to form a predetermined packaging structure. After a long period of bumping, vibration, aging, etc., the adhesive layer of this package will crack, resulting in figure 2 The shown LED chip falls off as indicated by the arrow Q, which will lead to poor edge sealing, and is not conducive to the heat dissipation of the LED chip, which consumes a lot of power, which is not conducive to energy saving and environmental protection. Contents of the invention [0003] Based on solvi...

Claims

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Application Information

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IPC IPC(8): H01L33/54H01L33/64
CPCH01L33/54H01L33/642H01L33/644H01L2224/24H01L2224/48091H01L2224/73265H01L2924/35121H01L2924/00014
Inventor 孙培清
Owner 浙江绿创新拓建筑规划设计有限公司
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