Black fungus scented crisp chip

A black fungus, crispy technology, applied in application, food preparation, food science, etc., can solve problems such as sticky taste and single nutrition
CN101647552AInactive Publication Date: 2010-02-17杨长河 +1

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
杨长河
Publication Date
2010-02-17
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention relates to a black fungus scented crisp chip, which is prepared from black fungi, black rice or black beans, black sesame seeds, water, refined salt or white sugar, pepper powder, monosodium glutamate and cooked vegetable oil through processing. The product has fragrant and crisp taste and rich nutrition, has the health-care function on hairs of a human body, can keep the hairs blackand shiny for long-term eating, has tasty, sweet and delicious flavour, simple preparation method and low cost, and is particularly suitable for being eaten by children and tourism to carry.
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Description

Technical field:

[0001] The invention relates to crispy black fungus slices. Background technique:

[0002] At present, there is a kind of crispy food made by adding flour with black fungus on the market, and the proportion of adding flour is no more than 20%. The black fungus crispy food made by adding flour has sticky mouthfeel, lacks crispness, and has single nutrition. It is not liked by the majority of consumers. Invention content:

[0003] The object of the present invention is to overcome the above-mentioned shortcoming, provide a kind of crispy black fungus chip, which solves the problems of sticky mouthfeel and single nutrition of the existing black fungus crispy food. The purpose of the present invention is achieved in this way, black fungus crispy slices it consists of: black fungus 350-400g, black rice or black beans 250-300g, black sesame 40-60g, water 230-250g, refined salt or white sugar 8-10g, pepper Powder 3-5g can be added or canceled according to taste...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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