Apparatus and method for manufacturing multilayer wiring board

Abstract

Provided are an apparatus and a method for manufacturing a multilayer wiring board, by which the multilayer wiring board can be more efficiently and accurately manufactured. A manufacturing apparatus (1) is provided with a temporarily welding section (12) for performing temporary welding to a stacked body composed of the prescribed number of stacked wiring boards (A) and prepreg (B); and a hole making section (14) for making a hole on the stacked body and performing main welding. In the temporarily welding section (12), further temporary welding can be performed to the stacked body prepared by adding a new wiring board to the stacked body to which the temporary welding has been performed. Basically, such process can be repeated as many times as required. While such repeated process is performed, a hole is made by the hold making section (14).

Description

technical field [0001] The present invention relates to a manufacturing device and a manufacturing method of a multilayer wiring board. Background technique [0002] Printed wiring boards on which electronic components such as IC chips, resistors, and capacitors are mounted are often used with higher densities and multilayers along with the miniaturization of these electronic components. This multilayer printed wiring board is composed of an outer conductor layer exposed outside the front and back layers and several inner conductor layers not exposed. [0003] The conductor outer layer is made of, for example, a copper foil having a thickness of about 18 μm. The conductor outer layer is supported by the insulating substrate together with the conductor inner layer constituted by the double-sided wiring substrate. As the insulating substrate, prepregs (prepregs) in which glass fibers are impregnated with a heat-curing epoxy resin are mainly used. [0004] To manufacture a m...

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Problems solved by technology

Therefore, if excessive stress is applied to the wiring board when inserting the pin, there is a possibility that the hole formed in the wiring board may be deformed.

In this way, the position offset becomes larger

[0008] Moreover, especially in the pin positioning lamination implementation method, there are (1) since the adhesive melted by heating adheres to the pins, it becomes troublesome to remove the multilayer wiring substrate, and (2) it is necessary to make a Adhesives perform fine cleaning work, and furthermore (3) when the number of stacked sheets is small, there may be problems such as the problem of damage starting from the above-mentioned hole.

[0009] Like this, in the manufacturing method of multilayer wiring substrate, although a plurality of implementation methods have been proposed, it is difficult to overcome the respective shortcomings only by applying each implementation method alone.

As a result, it is still a big problem to manufacture multilayer wiring boards more efficiently and with higher precision.

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