LED lamp and encapsulating method thereof
An LED lamp and packaging method technology, which is applied to lighting devices, lighting device parts, lighting and heating equipment, etc., can solve the problems of irregular matching, unsatisfactory light distribution curve, unsatisfactory light output effect, etc., to improve the spot and light shape, simple packaging method, and the effect of improving light efficiency
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[0037] see figure 2 , The LED lamp of the present invention includes a reflective cup 1 and LED chips 2, and the LED chip 2 is fixed in the bottom of the reflective cup 1 through a primer 3 having an adhesion function. The primer 3 can be silver glue or insulating glue. The LED chip 2 has positive and negative electrodes, and the reflective cup 1 has positive and negative electrodes. The positive and negative electrodes of the LED chip 2 are welded to the positive and negative electrodes of the reflective cup 1 by wires 4 . The light-transmitting body 5 is packaged on the surface of the LED chip 2 inside the reflective cup 1, and the light-transmitting body 5 fills up and covers the reflecting cup 1, and the material of the light-transmitting body 5 is epoxy resin or silica gel . In this embodiment, epoxy resin is used to coat the LED chip 2 and the reflective cup 1 in a die to form the light-transmitting body 5 . The thickness of the primer is 1 / 4-1 / 3 of the height of th...
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