Integrated circuit packaging structure and packaging method

Abstract

The invention relates to an integrated circuit packaging structure and a packaging method. The integrated circuit packaging structure comprises a circuit substrate, a packaging piece, an adhesion layer and a metal film, wherein the packaging piece is arranged on the circuit substrate; the adhesion layer is attached to the outer side of the packaging piece; and the metal film is attached to the adhesion layer and is connected with the circuit substrate. The integrated circuit packaging method comprises the following steps: providing the packaging piece, and arranging the packaging piece on the circuit substrate; attaching the adhesion layer to the outer side of the packaging piece; and attaching the metal film to the adhesion layer. Thus, the invention can reduce the packaging volume and the thickness of the whole integrated circuit packaging structure and can be used for increasingly thinner and smaller electronic products.

Description

technical field [0001] The invention relates to an integrated circuit packaging structure and a packaging method, in particular to an integrated circuit packaging structure and a packaging method capable of reducing the thickness of the integrated circuit packaging. Background technique [0002] With the development of electronic component technology, integrated circuits (integrated circuits) have replaced electronic components such as transistors and vacuum tubes for transmitting electronic signals or for computing purposes, making electronic products such as televisions and radios comparable to those of decades ago. Thin and short. However, the integrated circuit chip needs to be packaged to be fixed and electrically connected to the circuit substrate to prevent the invasion of moisture and moisture. [0003] The packaging technology of integrated circuit chips in the prior art is to connect one or more chips to a substrate such as a printed circuit board (PCB) or a print...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the defects existing in the existing integrated circuit packaging structure and packaging method, and provide a new integrated circuit packaging structure and packaging method, the technical problem to be solved is to make it solve the existing conventional technology The problem that the thickness of the integrated circuit packaging structure cannot be effectively reduced can be applied to increasingly thinner and smaller electronic products, which is very suitable for practical

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