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Cyanide-free gold electroplating liquid

A technology of electroplating gold and gold trichloride, which is applied in the field of surface modification of metal materials, can solve the problems of difficult recycling of gold plating solution, environmental pollution, explosive intermediate products, etc., and achieve good economic and social benefits

Inactive Publication Date: 2011-10-12
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional gold plating mainly adopts cyanide gold plating technology, which is a mature process, but cyanide is highly toxic, pollutes the environment, and the gold plating solution is difficult to recycle, so the cyanide-free gold plating process is highly valued
However, the instability of the cyanide-free gold plating solutions reported so far is a major problem. There are still many cyanide-free gold plating solutions that are quite complicated to configure. During the configuration process, the loss of gold is relatively large, which increases the cost of the plating solution and produces explosive intermediate products. , is another major obstacle hindering the development of cyanide-free gold plating

Method used

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  • Cyanide-free gold electroplating liquid
  • Cyanide-free gold electroplating liquid

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0013] Example 1: the composition of the gold plating solution is as follows:

[0014] Gold trichloride 12g / L,

[0015] Main complexing agent sodium sulfite 70g / L,

[0016] Auxiliary complexing agent EDTA 70g / L,

[0017] Sodium chloride 60g / L,

[0018] The rest is water.

[0019] Electroplating was carried out according to the composition of the above gold-plating solution. As a result, gold was plated on the copper wire, and the grains of the gold-plated layer were fine, showing a bright golden yellow color. The adhesive tape test was carried out to test the bonding force between the gold-plated layer and the substrate, and it was found that the gold-plated layer had no bubbles. Shedding phenomenon. After the plating solution was placed at room temperature for two months, the plating solution did not appear cloudy or discolored, and the performance of the obtained gold-plated layer was almost the same as before.

example 2

[0020] Example 2: the composition of the gold plating solution is as follows:

[0021] Gold trichloride 20g / L,

[0022] Main complexing agent potassium sulfite 130g / L,

[0023] Auxiliary complexing agent sodium citrate 80g / L,

[0024] Potassium chloride 80g / L,

[0025] The rest is water.

example 3

[0026] Example 3: the composition of the gold plating solution is as follows:

[0027] Gold trichloride 10g / L,

[0028] Main complexing agent sodium sulfite 50g / L,

[0029] Auxiliary complexing agent EDTA 50g / L,

[0030] Sodium chloride 50g / L,

[0031] The rest is water.

[0032] Electroplating is carried out according to the gold-plating solution described in example 2 and example 3, and the performances of the gold-plated layer obtained are all similar to the results of example 1.

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Abstract

The invention relates to cyanide-free gold electroplating liquid, and belongs to the field of surface modification of metal materials. The cyanide-free gold electroplating liquid has the advantages that: the electroplating liquid is non-toxic, simple in a formula and high in stability, does not have the phenomenon of turbidity and color change after being stood at normal temperature and still can be used. The cyanide-free gold electroplating liquid comprises the following main ingredients: gold trichloride, sodium sulfite or potassium sulfite serving as a main complexing agent, ethylene diamine tetraacetic acid (EDTA) or sodium citrate serving as an auxiliary complexing agent and sodium chloride or potassium chloride serving as inorganic salt. In the cyanide-free gold electroplating liquid, a new formula proportion is adopted, the cost is low, a plating layer is high in bonding force and bright, and the preparation of the functional gold plating layer is realized. The popularization and application of the cyanide-free gold electroplating liquid can create economic and social benefit.

Description

technical field [0001] The invention belongs to the field of surface modification of metal materials and provides a novel formula of a cyanide-free electroplating solution. Background technique [0002] Gold has stable chemical properties and has the advantages of low resistance and high thermal conductivity. The surface of high-power electronic components is often plated with gold to reduce high-frequency loss. The traditional gold plating mainly adopts cyanide gold plating technology, which is a mature process, but cyanide is highly toxic, pollutes the environment, and the gold plating solution is difficult to recycle, so the cyanide-free gold plating process is highly valued. However, the instability of the cyanide-free gold plating solutions reported so far is a major problem. There are still many cyanide-free gold plating solutions that are quite complicated to configure. During the configuration process, the loss of gold is relatively large, which increases the cost of...

Claims

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Application Information

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IPC IPC(8): C25D3/48
Inventor 范爱玲周净男冯昌川孟令胜
Owner BEIJING UNIV OF TECH