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Plating catalyst and method

A technology of electroless plating and stabilizer, applied in the field of metal electroless plating

Active Publication Date: 2015-03-04
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although many alternative catalysts to conventional tin / palladium catalysts have been developed, these catalysts still use palladium ions and none of them can meet the stability, activity and insulating surface adsorption properties necessary for the manufacture of electronic devices such as printed circuit boards.

Method used

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  • Plating catalyst and method
  • Plating catalyst and method
  • Plating catalyst and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] 155 mg of histidine (4-(2-amino-2-carboxyethyl)imidazole) was added to a beaker containing 36 mL of deionized water at room temperature (about 20° C.) to form a stabilizer solution. 0.1N HCl was added dropwise until all histidine was dissolved. Under stirring conditions, add dissolved 29.4mg Na 2 PdCl 4 (Pd +2 ) of 2 mL of deionized water. Then, the mixture was stirred at room temperature for ten minutes, and the pH was adjusted to 5.4. Subsequently, 30 mg of NaBH dissolved in the solution was added under vigorous stirring 4 2 mL of deionized water. The solution immediately turned black, indicating that Pd +2 reduced to Pd 0 .

[0052] Accelerated stability test: the above catalyst solution was then placed in a 50° C. water bath for at least 12 hours to further test its stability. Results The catalyst composition showed no visible precipitation or turbidity.

[0053]The working catalytic solution was prepared by diluting the catalytic concentration to 25 ppm w...

Embodiment 2

[0055] 310 mg of histidine was added to a beaker containing 38 mL of deionized water, and the mixture was heated to 60° C. to completely dissolve the histidine. After cooling to room temperature (about 20°C), add 1 mL of 1×10 -4 mol / L AgNO 3 solution. The solution was then stirred for ten minutes and the pH was adjusted to 12 using 0.1N NaOH. While stirring, 0.05 mL of formaldehyde solution (37%) was added to the solution, and then placed in a 60° C. water bath. The solution slowly turned bright orange and darkened as the reaction progressed. After about thirty minutes, the solution was dark orange in color. The reaction was continued at 60°C for one hour. The resulting histidine / silver nanoparticle catalyst composition was then subjected to the accelerated stability test of Example 1 and showed no precipitation or turbidity.

Embodiment 3

[0057] Na 2 PdCl 4 (138mg) was dissolved in 100mL deionized water, and 80mg of CuSO 4 ·5H 2 O. The solution turned blue-gray. Then 73 mg of histidine was added to the solution, and the solution turned slightly yellow. The pH of the resulting solution was adjusted to ~5.5 using 0.1N NaOH. Then 71mg of NaBH 4 Dissolve in 5mL deionized water. A small portion (0.5 mL) of NaBH 4 The solution was then added to the palladium / copper solution with vigorous stirring. NaBH 4 A color change to black was observed upon addition. The obtained catalyst solution was diluted to 250 ppm based on Pd, and stirred at room temperature for 30 minutes. The catalyst solution was then subjected to the accelerated stability test of Example 1 and showed no precipitation or cloudiness.

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Abstract

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Description

technical field [0001] The present invention relates generally to the field of electroless plating of metals. More particularly, it relates to metal electroless plating catalysts for non-conductive substrates used in the manufacture of electronic devices. Background technique [0002] Printed circuit boards consist of layered non-conductive insulating substrates that are connected by drilled or plated through holes on opposite sides of the board or between two adjacent layers of the board. Electroless metal plating is a well-known process for producing metal coatings on surfaces. Electroless metal plating on insulating surfaces requires the deposition of a catalyst. A common method used to catalyze or catalyze layered non-conductive insulating substrates is to treat the substrate with a tin-palladium hydrosol in an acidic chloride medium prior to electroless plating. Colloids consist of a stabilized layer complexed with tin(II) ions, such as SnCl 3 - The surrounding met...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/20C23C18/30
CPCC23C18/1875C23C18/1653C23C18/1646H05K3/42C23C18/2086C23C18/1639C23C18/30C23C28/02C23C18/405H05K2203/0716C23C18/16C23C18/32
Inventor M·A·热兹尼科刘锋
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC