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Plating catalyst and method

A technology of electroless plating and chemical formula, applied in the field of metal electroless plating

Active Publication Date: 2014-11-19
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although many alternative catalysts to conventional tin / palladium catalysts have been developed, these catalysts still use palladium ions and none of them can meet the stability, activity and insulating surface adsorption properties necessary for the manufacture of electronic devices such as printed circuit boards.

Method used

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  • Plating catalyst and method
  • Plating catalyst and method
  • Plating catalyst and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051]122 mg of 4-aminopyridine was added to a beaker containing 30 mL of deionized water at room temperature (about 20° C.) to form a stabilizer solution. Put the beaker into a 50°C water bath to completely dissolve the 4-aminopyridine stabilizer. In another beaker, 38.2 mg Na 2 PdCl 4 (Pd +2 ) was dissolved in about 10 mL of deionized water. The stabilizer solution was added dropwise to the palladium salt solution with vigorous stirring. After the stabilizer solution was added dropwise, the stirring was continued for 15-20 minutes. Subsequently, a solution of 12 mg NaBH was added to the mixture under vigorous stirring 4 about 2 mL of deionized water. The solution quickly turned gray-black, indicating that Pd +2 reduced to Pd 0 . The resulting 4-aminopyridine / palladium nanoparticle catalyst solution was stirred vigorously for an additional 30 minutes.

[0052] Accelerated stability test: the above catalyst solution was then placed in a 50° C. water bath for at least...

Embodiment 2

[0055] The 4-aminopyridine stabilizer was replaced by 4-dimethylaminopyridine, and the steps of Example 1 were repeated. The concentration of each component in the resulting composition is: 4.29g / L 4-dimethylaminopyridine; 0.96g / L Na 2 PdCl 4 , 0.3g / LNaBH 4 , and 3g / L sodium bicarbonate. The obtained 4-dimethylaminopyridine / palladium nanoparticle catalyst composition passed the accelerated stability test of Example 1 and showed no precipitation or turbidity.

Embodiment 3

[0057] The 4-aminopyridine stabilizer was replaced by 2-aminopyridine, and the steps of Example 1 were repeated. The concentration of each component in the resulting composition is: 1.5g / L 2-aminopyridine; 0.96g / L Na 2 PdCl 4 , 0.3g / L NaBH 4 , and 3g / L sodium bicarbonate. The obtained 2-aminopyridine / palladium nanoparticle catalyst composition passed the accelerated stability test of Example 1 and showed no precipitation or turbidity.

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Abstract

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Description

technical field [0001] The present invention relates generally to the field of electroless plating of metals. More particularly, it relates to metal electroless plating catalysts for non-conductive substrates used in the manufacture of electronic devices. Background technique [0002] Printed circuit boards consist of layered non-conductive insulating substrates that are connected by drilled or plated through holes on opposite sides of the board or between two adjacent layers of the board. Electroless metal plating is a well-known process for producing metal coatings on surfaces. Electroless metal plating on insulating surfaces requires the deposition of a catalyst. A common method used to catalyze or catalyze layered non-conductive insulating substrates is to treat the substrate with a tin-palladium hydrosol in an acidic chloride medium prior to electroless plating. Colloids consist of a stabilized layer complexed with tin(II) ions, such as SnCl 3 - The surrounding met...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/30
CPCC23C18/161B01J13/0043C23C18/1879C23C18/40B01J13/0034C23C18/1893C23C18/30C23C18/206C23C18/2086C23C18/1653C23C18/405C23C18/1608C23C18/16C23C18/32
Inventor 刘锋M·A·热兹尼科
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC