Method for adjusting temperature by increasing gas molecular density

An adjustment method and technology of gas density, applied in the direction of temperature control, heating method, application, etc. using electric mode, can solve the problems of known cooling process, etc., and achieve the effect of reducing manufacturing cost, saving consumption, and reducing equipment cost

Active Publication Date: 2014-06-25
ABLEPRINT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the known heating process also faces the problems of the known cooling process

Method used

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  • Method for adjusting temperature by increasing gas molecular density
  • Method for adjusting temperature by increasing gas molecular density
  • Method for adjusting temperature by increasing gas molecular density

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Embodiment Construction

[0039] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0040] According to one embodiment of the present invention, figure 1 A schematic diagram of a temperature conditioning processing system 100 is shown. The temperature adjustment processing system 100 may include a processing chamber 1 and a feedback temperature adjustment device 3 . The processing chamber 1 is connected to a feedback temperature adjustment device 3 via a gas pipeline 5 . The gas in the processing chamber 1 can flow into the feedback temperature adjustment device 3 through the gas pipeline 5 . One or more filters 7 may be further arranged between the processing chamber 1 and the feedback temperature adjustment device 3 to filter the gas flowing out of the chamber 1 . The feedback temperature adjustment device 3 may ...

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Abstract

The present invention relates to a method for adjusting temperature by increasing gas molecular density. The method includes: filling a chamber with at least one gas to a predetermined pressure, wherein the predetermined pressure is higher than 1 atm and lower than or equal to 50 atm; flowing the gas in the chamber to a temperature adjusting device, wherein the temperature adjusting device includes a cooler and a gas returning device; cooling the gas by the cooler; and returning the gas to the chamber by the gas returning device.

Description

technical field [0001] The present invention relates to a temperature adjustment method, in particular to a temperature adjustment method utilizing increased gas density. Background technique [0002] Among various industrial processes, cooling process and heating process often play an important role, and it is often necessary to switch between these cooling processes and heating processes. For example, switching between various processes that require different temperatures. During the switching period, the process temperature needs to be adjusted to the level applicable to the subsequent process. However, this adjustment often determines the key to the process efficiency. For example, cooling from high temperature to low temperature, or cooling from high temperature to low temperature and then heating to high temperature, etc., the faster the cooling and / or heating rate, the higher the process efficiency. For example, among known cooling processes, air-cooled or water-coo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/19
CPCA61L9/00F28F1/00F28F13/00F28D2021/0077F24F5/00F24H8/00F24F2221/34
Inventor 洪志宏
Owner ABLEPRINT TECH CO LTD
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