Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate distribution device

A technology of substrate and block, which is applied in pile separation, object separation, transportation and packaging, etc., can solve the problem that the sensor is not suitable for underwater work, and achieve the effect of avoiding water failure, ensuring work efficiency, and saving use costs.

Active Publication Date: 2014-09-03
ZHANGJIAGANG ULTRASONIC & ELECTRIC
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]Silicon wafer slicing is the pre-sequence process of chip insertion, and in order to segregate smoothly, it is generally selected to shard in water, that is, to carry out slicing in water, and then It is transmitted from water, so that the real-time monitoring of fragments can only be carried out underwater, and general sensors are not suitable for underwater work, so a solution that can solve this technical problem is urgently needed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate distribution device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Below in conjunction with the embodiment shown in the accompanying drawings, the present invention is described in detail as follows:

[0017] as attached figure 1 As shown, a slicer includes a feeding unit 10, a suction unit 20 and an induction unit 30. The feeding unit 10 is arranged in a water tank 101, and the feeding unit 10 is placed with multiple The substrate stack 102 of substrates, each substrate is arranged along a substantially vertical plane, and the substrates are completely positioned under the water surface in the water tank 101; Through the vacuum suction hole, the conveyer belt 201 is partially arranged in the water tank 101 and this part extends to the feeding unit 10. Generally, the bottom-up conveying method is selected, so the lower end of the suction unit 20 is arranged in the water tank 101, that is, The substrates are transported from the relative lower end of the conveyor belt 201 to the relative upper end. When the substrate stack 102 is...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a substrate distribution device comprising a feeding unit, an adsorbing unit and a sensing unit, wherein the feeding unit is arranged inside a water tank; the sensing unit comprises a sensing stop dog, a motion bar and a sensing switch; the sensing stop dog is located in the water tank; the sensing switch is located above the water surface; the sensing stop dog transmits actions to the sensing switch through the motion bar. A substrate stack is pushed by the feeding unit, so that the adsorbing unit adsorbs substrates and conveys the substrates one by one, substrate distribution is achieved, the movable sensing stop dog is arranged at the position where the substrates are initially adsorbed on a conveyor belt, the movable sensing stop dog triggers the sensing switch above the water surface through the motion bar, the sensing switch is triggered every time when one substrate is adsorbed, the signals of the sensing switch are utilized for controlling the substrates or counting the substrates, the sensing switch is arranged above the water surface, the situation that the sensing switch fails when getting wet is avoided, working efficiency is ensured, using cost is saved, and the substrate distribution device has extremely high advantages on the condition of substrate distribution in water.

Description

technical field [0001] The invention relates to a fragmentation device. Background technique [0002] Wafer slicing is the pre-sequence process of chip insertion. In order to shard smoothly, slicing is generally carried out in water, that is, slicing is carried out in water, and then transmitted from the water. In this way, the real-time monitoring of slicing is only It can be carried out underwater, but general sensors are not suitable for underwater work, so a solution that can solve this technical problem is urgently needed. Contents of the invention [0003] In view of the above-mentioned technical deficiencies, the object of the present invention is to provide a slicer, which pushes the stack of substrates through the feeding unit, absorbs and transports the substrates one by one through the suction unit, and transmits the action of the induction stopper to the Sensing the switch and triggering it to open, monitoring or counting, etc., the sensing switch is located a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B65H3/12
Inventor 陈宏
Owner ZHANGJIAGANG ULTRASONIC & ELECTRIC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com