Fragmentation device

Abstract

The invention discloses a substrate distribution device comprising a feeding unit, an adsorbing unit and a sensing unit, wherein the feeding unit is arranged inside a water tank; the sensing unit comprises a sensing stop dog, a motion bar and a sensing switch; the sensing stop dog is located in the water tank; the sensing switch is located above the water surface; the sensing stop dog transmits actions to the sensing switch through the motion bar. A substrate stack is pushed by the feeding unit, so that the adsorbing unit adsorbs substrates and conveys the substrates one by one, substrate distribution is achieved, the movable sensing stop dog is arranged at the position where the substrates are initially adsorbed on a conveyor belt, the movable sensing stop dog triggers the sensing switch above the water surface through the motion bar, the sensing switch is triggered every time when one substrate is adsorbed, the signals of the sensing switch are utilized for controlling the substrates or counting the substrates, the sensing switch is arranged above the water surface, the situation that the sensing switch fails when getting wet is avoided, working efficiency is ensured, using cost is saved, and the substrate distribution device has extremely high advantages on the condition of substrate distribution in water.

Description

technical field [0001] The invention relates to a fragmentation device. Background technique [0002] Silicon wafer slicing is the pre-sequence process of chip insertion, and for smooth slicing, it is generally selected to carry out slicing in water, that is, to carry out slicing in water, and then transmit it from the water. In this way, real-time monitoring of slicing is only It can be carried out underwater, but general sensors are not suitable for underwater work, so a solution that can solve this technical problem is urgently needed. Contents of the invention [0003] In view of the above-mentioned technical deficiencies, the object of the present invention is to provide a slicer, which pushes the stack of substrates through the feeding unit, absorbs and transports the substrates one by one through the suction unit, and transmits the action of the induction stopper to the Sensing the switch and triggering it to open, monitoring or counting, etc., the sensing switch i...

AI Technical Summary

Problems solved by technology

[0002] Silicon wafer slicing is the pre-sequence process of chip insertion, and for smooth slicing, it is generally selected to carry out slicing in water, that is, to carry out slicing in water, and then transmit it from the water. In this way, real-time monitoring of slicing is only Can be carried out underwater, and general sensors are not suitable for underwater work, so there is an urgent need for a solution that can solve this technical problem

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