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Winding and clamping device of flexible substrate

A flexible substrate winding and packaging technology, which is applied in the field of flexible substrate winding and clamping devices, can solve the indispensable problems of winding and coating, and achieve the effects of material saving, convenient operation and high clamping reliability

Active Publication Date: 2014-10-08
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, winding coating technology is also indispensable in the production process of expressway reflective signs.

Method used

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  • Winding and clamping device of flexible substrate
  • Winding and clamping device of flexible substrate
  • Winding and clamping device of flexible substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The present invention will be further described in detail in conjunction with the accompanying drawings and specific embodiments.

[0030] The winding and clamping device for the flexible substrate includes: a clamping sleeve, a clamping core and a clamping device.

[0031] The clamping sleeve is in the shape of a cylinder, and one end is provided with a power shaft coaxial with the clamping sleeve. There is a ring-shaped inwardly concave circlip groove between the power shaft and the clamping sleeve. When installing, install the power shaft on a fixed On the bearing with seat, buckle the circlip into the circlip groove and lock it. The other end of the clamping sleeve is used for inserting or taking out the clamping core. A plurality of screw holes arranged in rows are arranged above the clamping sleeve, the extension direction of the multiple screw holes is parallel to the axis of the clamping sleeve, and the depth direction of the screw holes is consistent with the ...

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PUM

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Abstract

The invention relates to a winding and clamping device of a flexible substrate. The device includes a clamping sleeve, a clamping core and a pressing apparatus. The clamping sleeve is provided with a material-feeding groove which is used for the flexible substrate to pass through. The clamping sleeve externally sleeves the clamping core. The pressing apparatus passes through the clamping sleeve and pressing the clamping core tightly to enable the clamping core to be attached to an inner wall of the clamping sleeve. The pressing apparatus is formed by a plurality of fastening screws which are in parallel with each other. A plurality of screw holes are formed in the clamping sleeve, wherein the number of the screw holes is same as that of the fastening screws. Each fastening screw passes through the screw hole and presses one side of the clamping core tightly. The winding and clamping device has advantages of being simple in structure and convenient to operate, and being capable of achieving a uniformly-forced clamping operation of the flexible substrate. The winding and clamping device belongs to the technical field of mechanical winding process.

Description

technical field [0001] The invention relates to the technical field of mechanical winding processing, in particular to a simple and reliable flexible substrate winding and clamping device, which completes the clamping and winding of the flexible substrate. Background technique [0002] Nowadays, the application range of thin film materials is becoming wider and wider, and its position in high-tech is becoming more and more important. It is necessary to produce more films with excellent performance and unique functions. Therefore, it greatly stimulates and promotes the continuous progress of thin film manufacturing technology. and development. [0003] Coating technology is a technology that originated in the 1930s and was not developed until the late 1970s. Vacuum evaporation, sputter coating and ion plating are commonly referred to as physical vapor deposition methods, which are basic thin film preparation techniques. The vacuum roll-to-roll coating technology has many ap...

Claims

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Application Information

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IPC IPC(8): C23C14/50
Inventor 汤勇温万昱黄云翔
Owner SOUTH CHINA UNIV OF TECH
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