The invention relates to a bismaleimide structural
adhesive film with a high
temperature resistance level as well as a preparation method and application thereof, and relates to a structural adhesivefilm. The structural
adhesive film solves the problem that the conventional bismaleimide structural
adhesive film is low in basic intensity or low in
temperature resistance level. The structural adhesive film is prepared from a bismaleimide
monomer composition, an allyl phenoxyl compound
monomer modifier, a high-
polymer material flexibilizer, an inorganic
nanometer particle thixotropic agent and acarrier. The method comprises the following steps: melting phthalazinone structural
thermoplastic resin into a modifier in a hot melting manner, then performing hot melting blending on the bismaleimide
monomer composition, active
end group liquid rubber and the resin, feeding the thixotropic agent into a resin
system, and uniformly mixing, so as to form a
sizing material, and compounding the
sizing material with the carrier, so as to obtain the structural adhesive film. The normal temperature
shear strength of the adhesive film can reach 20.2 MPa, 316 DEG C
shear strength can still reach 10.8MPa, and the
honeycomb cylinder peel strength reaches 95.0 N.m / m. The adhesive film is applied to cementing of
aerospace refractory metal or
composite material structural pieces.