Bismaleimide structural adhesive film with high temperature resistance level as well as preparation method and application thereof

A technology of bismaleimide and maleimide monomer is applied in the field of grade bismaleimide structural adhesive film and its preparation, and can solve the problem of low shear strength, low temperature resistance grade, bismaleimide The basic strength of the imide structural adhesive film (low shear and peel toughness problems, etc., achieves the effect of high shear strength, high temperature resistance grade, and good process performance)

Active Publication Date: 2019-05-14
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing bismaleimide structural adhesive film has either low base strength (shear and peel toughness), or a low temperature resistance grade, especially the problem of low shear strength at 316°C ; Provide a high temperature-resistant grade bismaleimide structural adhesive film and its preparation method and application, so that its basic strength and temperature-resistant grade can reach a higher level at the same time

Method used

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  • Bismaleimide structural adhesive film with high temperature resistance level as well as preparation method and application thereof

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specific Embodiment approach 1

[0015] Specific implementation mode 1: A high temperature-resistant grade bismaleimide structural adhesive film in this embodiment, the high temperature-resistant grade bismaleimide structural adhesive film is composed of 75 to 100 parts by mass of bis Maleimide monomer composition, 75-100 parts of propenyl phenoxy compound monomer modifier, 10-25 parts of polymer material toughening agent and 1-5 parts of inorganic nanoparticle thixotropic agent and carrier Made; wherein, the bismaleimide monomer composition is composed of bismaleimide containing phenolphthalein side group, bismaleimide containing fluorenyl Cardo ring structure and 4,4'-bismaleimide The aminodiphenylmethane type bismaleimide is composed of a mass ratio of 2:2:1.

specific Embodiment approach 2

[0016] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the bismaleimide structural adhesive film of the high temperature resistance grade is made of 80-90 parts by mass of bismaleimide It is made of amine monomer composition, 80-90 parts of propenyl phenoxy compound monomer modifier, 15-20 parts of polymer material toughening agent, 2-4 parts of inorganic nano particle thixotropic agent and carrier. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0017] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the bismaleimide monomer composition is composed of bismaleimide containing phenolphthalein pendant group, bismaleimide containing fluorenyl Cardo ring structure The maleimide and the 4,4'-diaminodiphenylmethane bismaleimide are composed in a mass ratio of 2:2:1. Others are the same as in the first embodiment.

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Abstract

The invention relates to a bismaleimide structural adhesive film with a high temperature resistance level as well as a preparation method and application thereof, and relates to a structural adhesivefilm. The structural adhesive film solves the problem that the conventional bismaleimide structural adhesive film is low in basic intensity or low in temperature resistance level. The structural adhesive film is prepared from a bismaleimide monomer composition, an allyl phenoxyl compound monomer modifier, a high-polymer material flexibilizer, an inorganic nanometer particle thixotropic agent and acarrier. The method comprises the following steps: melting phthalazinone structural thermoplastic resin into a modifier in a hot melting manner, then performing hot melting blending on the bismaleimide monomer composition, active end group liquid rubber and the resin, feeding the thixotropic agent into a resin system, and uniformly mixing, so as to form a sizing material, and compounding the sizing material with the carrier, so as to obtain the structural adhesive film. The normal temperature shear strength of the adhesive film can reach 20.2 MPa, 316 DEG C shear strength can still reach 10.8MPa, and the honeycomb cylinder peel strength reaches 95.0 N.m / m. The adhesive film is applied to cementing of aerospace refractory metal or composite material structural pieces.

Description

technical field [0001] The invention relates to a high temperature curing high temperature resistant structural adhesive, in particular to a high temperature resistant grade bismaleimide structural adhesive film and its preparation method and application. Background technique [0002] Structural adhesive is an adhesive used for the bonding of primary or secondary load-bearing structures. It can transmit large dynamic and static loads and has long life characteristics in the use environment. Compared with other types of structural adhesives such as paste or solvent, film structural adhesives have the advantages of low volatile content, uniform and controllable adhesive layer thickness, high strength, high toughness, high durability and high reliability. It is widely used in aerospace field. [0003] At present, there are commercialized high-temperature-resistant bismaleimide structural adhesive films at home and abroad, either with low base strength (shear and peel toughness...

Claims

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Application Information

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IPC IPC(8): C09J7/10C09J179/08C09J11/04C09J11/08
Inventor 王德志曲春艳杨海冬冯浩李洪峰刘长威宿凯张杨肖万宝关悦愉王海民杜程
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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