Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

3results about How to "Reduce the maximum" patented technology

A fusion reactor divertor tube-plate composite module and cooling target plate structure

ActiveCN117690607Breduce plastic deformationreduce stress levels
This invention discloses a fusion reactor divertor tube-plate composite module and cooling target plate structure, relating to the field of magnetic confinement fusion divertor technology. The composite module includes a plasma-facing component and a transition layer. The plasma-facing component is located on the periphery and is used for contact with the plasma. A through-hole matching the transition layer is provided in the plasma-facing component. The transition layer is metallurgically connected within the through-hole, and a cooling pipe is metallurgically connected within the transition layer. Coolant flows through the cooling pipe to remove heat generated by fusion. The outer side of the transition layer has a U-shaped structure with a flat top and a round bottom, while the inner side has a circular structure. This design effectively increases the weight ratio of the transition layer to the plasma-facing component, improving the overall thermal conductivity of the composite module, alleviating stress and strain concentration problems, and ensuring the safety of the divertor target plate module, preventing the target plate material from detaching and contaminating the reactor core plasma under high heat loads.
Owner:SOUTHWESTERN INST OF PHYSICS

Improved floating slab-over-slab shear hinge

The utility model discloses an improved floating plate upper -placed formula slab shear hinge, this shear hinge includes the embedded sleeve pipe in the floating plate, installs the stud in this embedded sleeve pipe, the upper surface of low side's floating plate places the height -adjusting base plate, and the height -adjusting base plate or the floating plate is provided with the buffer pad and the shear plate, and the shear plate, buffer pad, height -adjusting base plate realize the fixed through the double -layer single -cut groove self -locking nut and flat washer of stud top. Wherein, be provided with stiffened plate on shear plate, and through the optimization shear hinge stud's layout position solved the uneven problem of existing shear hinge stud stress. Through the optimization shear plate shape, reduced the thickness of shear plate, saved the use of material, embedded steel sleeve pipe bottom 2 layer bottom plate for increasing the pullout resistance of embedded steel sleeve pipe. The stud only sets up the screw thread in the lower part, is used for the axial force that the stud received is transmitted to the inside of floating plate, reduces the stress level of floating plate surface concrete to reduce or avoid the damage of the board body.
Owner:ANJINGER (SHANGHAI) TECH CO LTD

Easi3b module with improved heat dissipation performance

The invention discloses an easy3b module with improved heat dissipation performance, and relates to the technical field of power module heat dissipation, the easy3b module comprises a power module, a plurality of chips are integrated on the power module, the easy3b module further comprises a heat conduction structure fixed on the power module, a cavity is formed in the heat conduction structure, and a capillary structure and phase change liquid are arranged in the cavity, the heat conduction structure is used for absorbing heat of the power module and the chip; the soaking structure is fixed to the side, away from the chip, of the heat conduction structure, the side, facing the heat conduction structure, of the soaking structure is provided with an opening, the opening is provided with a phase change material, the phase change material is arranged between the soaking structure and the heat conduction structure in a surrounding mode, and the phase change material is attached to the corresponding faces of the soaking structure and the heat conduction structure at the same time; the projection of the phase change material on the corresponding surface of the power module at least covers the positions of the plurality of chips. In this way, the maximum value of the local highest temperature caused by heating of the chip position on the power module can be reduced, and it is avoided that a safety threshold value is reached.
Owner:INST OF ENERGY HEFEI COMPREHENSIVE NAT SCI CENT (ANHUI ENERGY LAB) +1