The invention discloses an easy3b module with improved heat dissipation performance, and relates to the technical field of
power module heat dissipation, the easy3b module comprises a
power module, a plurality of chips are integrated on the
power module, the easy3b module further comprises a heat conduction structure fixed on the power module, a cavity is formed in the heat conduction structure, and a capillary structure and
phase change liquid are arranged in the cavity, the heat conduction structure is used for absorbing heat of the power module and the
chip; the soaking structure is fixed to the side, away from the
chip, of the heat conduction structure, the side, facing the heat conduction structure, of the soaking structure is provided with an opening, the opening is provided with a
phase change material, the
phase change material is arranged between the soaking structure and the heat conduction structure in a surrounding mode, and the
phase change material is attached to the corresponding faces of the soaking structure and the heat conduction structure at the same time; the projection of the
phase change material on the corresponding surface of the power module at least covers the positions of the plurality of chips. In this way, the maximum value of the local highest temperature caused by heating of the
chip position on the power module can be reduced, and it is avoided that a safety threshold value is reached.