A high-efficiency high-performance LED

A high-performance, high-efficiency technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the thermal conductivity of the substrate, the power of the whole lamp cannot be increased, and the power of the whole lamp is low, etc. Production feasibility, yield, and high light efficiency

Active Publication Date: 2017-02-01
ZHEJIANG INTELED OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention mainly solves the problems in the prior art that LEDs need to be coated and packaged on both sides, the process is complex, the operation is difficult, and the power of the whole lamp cannot be increased due to the limitation of heat dissipation, and it provides a high-efficiency and high-performance LED
Secondly, the use of a transparent substrate infiltrated with fluorescent powder realizes a surface light source, makes the light source more uniform, and can also appropriately increase the thermal conductivity of the substrate, which solves the problem of low power of the existing 360-degree light-emitting LED due to heat dissipation.

Method used

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  • A high-efficiency high-performance LED
  • A high-efficiency high-performance LED
  • A high-efficiency high-performance LED

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Embodiment

[0022] In this embodiment, a high-efficiency and high-performance LED, such as figure 1 and figure 2 As shown, the substrate 1 is included, the substrate is a transparent substrate, and phosphor powder is evenly permeated in the substrate. Several light-emitting chips 2 are arranged on the upper surface of the substrate, and the light-emitting chips are connected by gold wires. The two ends of the substrate are respectively provided with metal sheets 4, and the gold wires of the light-emitting chips located at the two ends are connected to the metal sheets. A metal frame 10 for fixing is also installed on the metal sheet. A dielectric layer 3 is packaged on the side of the substrate where the light-emitting chip is located.

[0023] Such as Figure 5 and Figure 6 As shown, the metal sheet is wrapped and arranged on both ends of the substrate, the metal sheet is provided with a nozzle 5, the bottom side of the nozzle is provided with a clip 6 along the edge, and a clip g...

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Abstract

The invention relates to a high-light effect and high-performance LED (light-emitting diode), which aims to solve the problems that the process is complicated and the operation difficulty is high due to the fact that double-faced coating and packaging need to be performed on the traditional LED, and the traditional LED is limited by heat dissipation and the power of the whole lamp cannot be high in the prior art. The high-light effect and high-performance LED structurally comprises a substrate; the substrate is provided with a plurality of luminous chips; the substrate is a transparent substrate; fluorescent powder evenly penetrates into the substrate; a media layer is packaged on one face, on which the luminous chips are located, of the substrate; both ends of the substrate are respectively provided with a metal sheet; a bayonet is formed in each metal sheet; the substrate is embedded in the bayonets; the bottom face of the substrate is a rugged face. The high-light effect and high-performance LED disclosed by the invention has the advantages that the color consistency and the stability of the LED product are improved while the high light effect of the product and the performance of the fluorescent powder are ensured by adopting the transparent substrate into which the fluorescent powder penetrates, so that light emitted from a light source is evener, the heat conductivity coefficient of the substrate is increased, the high-difficulty operation that fluorescent powder coating or dispensing is performed on both faces of the traditional filament LED is avoided, and the mass producibility and the yield are greatly improved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an LED with high light efficiency and high performance. Background technique [0002] The development of white light-emitting diode (LED) technology has brought us into the fourth generation of lighting. White light-emitting diode (LED) lighting will surely replace today's lighting technology due to its advantages of low energy consumption and environmental protection. For lighting purposes, high-power white light-emitting diodes (LEDs) have been widely concerned by scientific research and enterprises. In order to generate sufficient light intensity, the working current of light-emitting diodes (LEDs) must be as large as possible, and the large working current is required for the packaging of light-emitting diodes (LEDs). The heat dissipation problem of the system has brought serious challenges. Therefore, how to solve the heat dissipation problem of LEDs, improve the light output...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/64
CPCH01L33/486H01L33/507H01L33/641H01L33/642H01L2933/0041
Inventor林成通连程杰李玉花
OwnerZHEJIANG INTELED OPTOELECTRONICS TECH