Led lighting module and lighting device using said module

A technology of LED lighting and lighting devices, which is applied in the direction of lighting devices, lighting auxiliary devices, lighting device components, etc., can solve problems such as deterioration of heat dissipation characteristics of street lamps, safety accidents, and deterioration of heat dissipation characteristics, so as to prevent imbalance Effects of heat distribution, prevention of safety accidents, and prevention of deterioration of heat dissipation characteristics

Inactive Publication Date: 2015-03-25
KMW INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Moisture can freeze in winter to become icicles, and when the icicles thaw and fall, safety incidents can occur
In addition, moisture makes it easy for dust to adhere to the frame, and the dust adhering to the frame deteriorates the heat dissipation characteristics of the street lamp
Due to the heat generated from the LED, the deterioration of the heat dissipation characteristics contributes to the reduction of the life cycle of the LED

Method used

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  • Led lighting module and lighting device using said module
  • Led lighting module and lighting device using said module
  • Led lighting module and lighting device using said module

Examples

Experimental program
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Embodiment Construction

[0045]Hereinafter, an LED lighting module according to a preferred embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0046] figure 1 is a perspective view of an LED lighting module according to a preferred embodiment of the present disclosure, and figure 2 is along figure 1 A cross-sectional view of the LED lighting module cut by line A-A.

[0047] refer to figure 1 and 2 , The LED lighting module according to the preferred embodiment of the present disclosure may include: a frame 100, the lower part of which has a receiving groove 110 to provide a heat dissipation opening and the upper part thereof has a slope 120, the central area of ​​which is higher than other areas; the base 200, Fixed on the inner upper surface of the housing groove 110 of the frame 100 and has a plurality of LED packages 210 mounted on it; a plurality of heat dissipation fins 300 are arranged on the upper surface of the frame 100; the fi...

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Abstract

The present invention relates to an LED lighting module and to a lighting device using said module. The LED lighting module comprises: a body frame, the base of which has an accommodation groove; a substrate fixed at an inner installation surface of the accommodation groove of the body frame and having multiple LED packages mounted thereon; multiple heat-dissipating fins arranged on an upper surface and a side surface of the body frame and spaced apart from each other; and a fixing unit protruding from the upper surface of the body frame and having a base surface with a coupling hole for coupling the substrate by means of a bolt. The LED lighting module of the present invention is provided with the protruding fixing unit having an inner surface with the coupling hole for fixing the substrate to the body frame by means of a bolt, and therefore, the overall thickness of the body frame is reduced in order to reduce the weight of the module and improve heat-dissipating characteristics of the module.

Description

technical field [0001] The present invention relates to an LED lighting module and a lighting device using the same, and more particularly, to an LED lighting module having excellent heat dissipation characteristics and light weight and a lighting device using the same. Background technique [0002] Recently, research has been conducted on applying LEDs, which have less power consumption and a longer life cycle than other light sources, to lighting devices. Since heat generated in the LED package is a factor reducing the life cycle of the LED package, research and development on a structure for efficiently dissipating heat from the LED package has also been conducted in various ways. [0003] In particular, LED street lamps using a plurality of LED packages require improvement in heat dissipation characteristics. However, for the structure in which the heat dissipation fins are mounted on the rear side of the PCB substrate with the LED package, there is a limit in effective...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V17/12F21V29/76
CPCF21K9/00F21V5/008F21V5/04F21V19/0055F21V19/02F21W2131/103F21Y2101/00F21V17/104F21V29/74F21V29/763F21Y2105/10F21Y2115/10F21V21/30
Inventor 金德龙
Owner KMW INC
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