Semiconductor device, method of manufacturing same, and method of controlling semiconductor device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- RENESAS ELECTRONICS CORP
- Publication Date
- 2015-09-02
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
[0001] Cross References to Related Applications
[0002] Japanese Patent Application No. 2014-036886 filed on February 27, 2014 including specification, drawings and abstract is incorporated herein by reference in its entirety. technical field
[0003] The present invention relates to a semiconductor device, a method of manufacturing the semiconductor device, and a method of controlling the semiconductor device, and more particularly, to a semiconductor device including a photoelectric conversion element such as a photodiode, a method of manufacturing the semiconductor device, and a method of controlling the semiconductor device. Background technique
[0004] Image sensors for automotive digital cameras, particularly digital single-lens reflex cameras, are typically fabricated by forming wiring, applying a glass coating to the wiring, and then forming dichroic color filters and light-collecting on-chip lenses on the glass coating. The reflected light from the subject passes...