Design method and apparatus for ensuring proper installation of CPU heat sink

A design method and heat sink technology, applied in the computer field, can solve problems such as poor heat dissipation, easy omission, automatic restart, etc., and achieve the effect of eliminating quality problems

Active Publication Date: 2015-09-09
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Generally, the CPUs of computers, servers, storage and other products are generally equipped with radiators. Now the way to fix the radiators is usually to fix the 4 screws of the radiators to the corresponding base of the motherboard. The current control method for the screw installation of the radiators is mainly It is carried out through manua

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  • Design method and apparatus for ensuring proper installation of CPU heat sink

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[0021] A design method and device for ensuring that the CPU radiator is installed in place of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] As shown in the accompanying drawings, a design method for ensuring that the CPU radiator is installed in place according to the present invention, its structure includes a motherboard power supply circuit and a CPU radiator,

[0023] At the base of the fixing screws at the four corners of the CPU cooler, add a pressure on-off circuit respectively,

[0024] Four pressure on-off circuits are serially connected in series,

[0025] The motherboard power circuit is connected in series with the power switch of the motherboard jumper, and the power switch of the motherboard jumper is connected in series with four pressure on-off circuits.

[0026] Four pressure on-off circuits are serially connected to the mainboard power supply circuit.

[0027] The pressure on-off circuit adop...

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Abstract

The present invention, belonging to the technical field of computers, provides a design method and apparatus for ensuring proper installation of a CUP heat sink. With respect to the structure, the apparatus comprises a main board power supply circuit and a CPU heat sink. A pressure on-off circuit is disposed at the position of the securing screws at each of the four side corners on the base of the CPU heat sink. The four pressure on-off circuits are sequentially connected in series. The main board power supply circuit is connected in series to the power supply switch of a main board jumper. The power supply switch of the main board jumper is sequentially connected in series to the four pressure on-off circuits. The four pressure on-off circuits are connected in series to the main board power supply circuit. According to the present invention, if the screws for the heat sink are not installed or are not properly installed, foolproof design when power is applied fails to be achieved, a protection effect may be exerted on the important components such as the CPU, main board and the like, and the quality problem caused by a failure to install the screws on the heat sink or improper installation of the screws on the heat sink is prevented.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a design method and device for ensuring that a CPU radiator is installed in place. Background technique [0002] Generally, the CPUs of computers, servers, storage and other products are generally equipped with radiators. Now the way to fix the radiators is usually to fix the 4 screws of the radiators to the corresponding base of the motherboard. The current control method for the screw installation of the radiators is mainly It is carried out through manual control. Generally, manual inspection and electric screw large torque are used for inspection, which is prone to omissions. Once the heatsink screws are not fixed in place or the screws are missing, poor heat dissipation will occur, which may cause system downtime and automatic restart, or even burn valuable components such as the CPU and motherboard. Contents of the invention [0003] The technical task of the present i...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
Inventor 卢业勇
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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