Electronic Package And Fabrication Method Thereof

An electronic package and electronic component technology, which is applied to electrical components, electrical components, electrical solid devices, etc., can solve the problems of difficulty in reducing the width of the substrate 10, difficulty in reducing the width of the wireless communication module 1, and difficulty in integrating and manufacturing, so as to reduce the width. Effect

Inactive Publication Date: 2015-09-23
SILICONWARE PRECISION IND CO LTD
View PDF4 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 11 and the volume limitation of the antenna structure 12, in the manufacturing process, the The antenna body 120 is difficult to integrate with the electronic component 11, that is, the packaging material 13 only covers the electronic component 11, but not the antenna body 120, so that the mold for the packaging process needs to correspond to the layout area of ​​these el

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic Package And Fabrication Method Thereof
  • Electronic Package And Fabrication Method Thereof
  • Electronic Package And Fabrication Method Thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] The implementation of the present invention will be described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0044] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight, and easy to manufacture. It is widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDA). [0003] figure 1 It is a three-dimensional schematic diagram o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K5/02H01Q1/22H05K9/00H05K13/00
CPCH01Q1/526H01Q9/0407H01Q1/22H01L23/552H01L23/66H01L2223/6677H01L2224/16227H01L2224/48091H01L2224/48227H01L2924/19105H01L2924/3025H01Q1/42H01Q9/42H01Q23/00Y10T29/49018H01L2924/00014
Inventor 邱志贤蔡宗贤蔡屺滨郑志铭
Owner SILICONWARE PRECISION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap