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Solar power supply driving circuit board apparatus assembly

A solar power supply and solar panel technology, applied in battery circuit devices, circuit devices, electric vehicles, etc., can solve problems such as increased installation cost, impact on targeted heat dissipation of heat dissipation chips, and difficulty in maintenance and installation by users

Inactive Publication Date: 2016-01-20
方小刚
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
If the positioning is inaccurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting the operation stability and reliability of the overall system of the circuit board

Method used

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  • Solar power supply driving circuit board apparatus assembly
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Embodiment Construction

[0009] Combine below Figure 1-2 The present invention will be described in detail.

[0010] A circuit board device assembly driven by solar power according to an embodiment, comprising a circuit board device 12, a hinged frame 9 fixedly arranged at one end of the circuit board device 12, and a cooling plate device 2 connected to the hinged frame 9, Wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for connecting with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable clamping positioning block 5 respectively. One end of the hinge frame 9 is also fixed with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and one end of the horizontal guide rod 14 wound with the horizontal tension spring 13. connected, the other end of the vertical guide rod 3 and the other end of the horizontal guide rod 14 are respectively fixedly ...

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Abstract

A solar power supply driving circuit board apparatus assembly comprises a circuit board apparatus (12), a hinged frame (9) fixedly arranged on one end of the circuit board apparatus (12) and a cooling plate apparatus (2) connected to the hinged frame (9). A main body block (91) of the hinged frame (9) is provided with a vertical guide rail groove (10) and a horizontal guide rail groove (7) which are used for carrying out sliding fit with one end of a clamping positioning block (11) capable of sliding vertically and with one end of a clamping positioning block (5) capable of sliding horizontally. The main body block (91) of the hinged frame (9) is fixedly connected to a vertical guide rod (3) which is wrapped with a vertical stretching spring (4) and is fixedly connected to one end of a horizontal guide rod (14) which is wrapped with a horizontal stretching spring (13).

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board assembly driven by solar power. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H02J7/35
Inventor 方小刚
Owner 方小刚