Method for producing plated laminate, and plated laminate

A manufacturing method and laminated body technology, applied in contact manufacturing, contact parts, etc., can solve problems such as insufficient adhesion between tin plating and silver plating, and achieve excellent wear resistance, electrical conductivity and fit , Inhibition of embrittlement, excellent wear resistance

Active Publication Date: 2016-02-24
ORIENTAL MEKKI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, tin and silver are alloyed by heating, and insufficient adhesion between tin plating and silver plating inevitably becomes a serious problem (that is, it is not a technology to laminate good silver plating on tin plating.

Method used

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  • Method for producing plated laminate, and plated laminate
  • Method for producing plated laminate, and plated laminate
  • Method for producing plated laminate, and plated laminate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0129] figure 2 It is a schematic sectional view of 1st Embodiment of the plated laminated body of this invention. In the plated laminate 1 , the tin-plated layer 4 is formed on the surface of the metal substrate 2 , and the nickel-plated layer 6 is formed on the entire surface of the tin-plated layer 4 . In addition, a silver strike plating layer 8 is formed on the entire surface of the nickel plating layer 6 , and a silver plating layer 10 is formed on the entire surface of the silver strike plating layer 8 . In addition, a silver strike plating layer (not shown) similar to the silver strike plating layer 8 is formed between the tin plating layer 4 and the nickel plating layer 6 as needed.

[0130] The metal of the metal substrate 2 is not particularly limited as long as it has electrical conductivity. For example, aluminum and aluminum alloys, iron and iron alloys, titanium and titanium alloys, stainless steel, copper and copper alloys, etc. can be mentioned. Among them, ...

no. 2 approach

[0136] image 3 It is a schematic sectional view of 2nd Embodiment of the plated laminated body of this invention. In the plated laminate 1 , the tin-plated layer 4 is formed on the surface of the metal substrate 2 , and the nickel-plated layer 6 is formed on the entire surface of the tin-plated layer 4 . In addition, a silver strike plating layer 8 is formed on the entire surface of the nickel plating layer 6 , and a silver plating layer 10 is formed on a part of the surface of the silver strike plating layer 8 . In addition, except that the silver plating layer 10 is formed on a part of the silver strike plating layer 8, it is the same as the first embodiment.

no. 3 approach

[0138] Figure 4 It is a schematic sectional view of 3rd Embodiment of the plated laminated body of this invention. In the plated laminate 1 , the tin-plated layer 4 is formed on the surface of the metal substrate 2 , and the nickel-plated layer 6 is formed on a part of the surface of the tin-plated layer 4 . In addition, a silver strike plating layer 8 is formed on the entire surface of the nickel plating layer 6 , and a silver plating layer 10 is formed on the entire surface of the silver strike plating layer 8 . In addition, a nickel plating layer 6 is formed on a part of the surface of the tin plating layer 4, a silver strike plating layer 8 is formed on the entire surface of the nickel plating layer 6, and a silver plating layer is formed on the entire surface of the silver strike plating layer 8. 10. Other than that, it is the same as the first embodiment.

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Abstract

Provided are: a tin-plated / silver-plated laminate, which has excellent abrasion resistance, electrical conductivity and slidability and a low frictional property, and whereby it becomes possible to prevent the embrittlement of a plating layer contained therein; and a method for producing the tin-plated / silver-plated laminate. The present invention is a method for producing a plated laminate by forming a silver plating layer on a tin plating layer that is formed on the surface of a metallic base material, said method being characterized by comprising: a first step of subjecting an arbitrary region in the surface of a tin plating layer to a nickel plating treatment, thereby forming a nickel plating layer; a second step of subjecting an arbitrary region in the surface of the nickel plating layer to a silver strike plating treatment; and a third step of subjecting at least a part of the surface region of the nickel plating layer, which has been subjected to the silver strike plating treatment, to a silver plating treatment.

Description

technical field [0001] The present invention relates to a method for producing a plated laminate and a plated laminate obtained by the production method, and more specifically, to a plated laminate having excellent wear resistance, electrical conductivity, sliding properties and low friction and suitable for use in Tin-plated / silver-plated laminate suppressing embrittlement of plating and method for producing the same. Background technique [0002] Silver plating has excellent characteristics such as electrical conductivity, low contact resistance, and heat resistance, and is widely used in electrical and electronic parts such as various contacts, terminals, connectors, and switches (for example, refer to Patent Document 1 (Japanese Patent Laid-Open 2001 - Bulletin No. 3194)). [0003] In recent years, electric vehicles, plug-in hybrid vehicles, etc. have become more popular, and charging devices such as home charging devices and quick charging devices have also become more...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/12C25D5/50H01R13/03
CPCC25D5/12C25D5/50C25D3/12C25D3/38C25D3/46C25D3/48C25D3/50C25D5/14H01R13/03C25D5/34C25D5/617H01R43/16
Inventor 高桥宏祯
Owner ORIENTAL MEKKI
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