Gold wire fixing structure for gold wire bonding
A fixed structure, gold wire bonding technology, applied in the direction of electric solid devices, semiconductor/solid state device components, waveguide devices, etc., can solve the problems of falling off, communication disconnection, disappearance of demand angle, etc., to reduce the loosening and falling off of solder joints risk, enhance stability and reliability, ensure the effect of bending angle
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[0017] The specific embodiment of the present invention will be further described below in conjunction with accompanying drawing and specific embodiment:
[0018] like Figure 1-3 As shown, a gold wire fixing structure for gold wire bonding is made of non-conductive materials or non-conductive and non-metallic materials, including a gold wire angle positioning piece 1, and the material of the gold wire angle positioning piece 1 is poly Ether imide, the gold wire angle positioning part 1 is provided with a plurality of mutually independent threading channels, the length of the gold wire angle positioning part 1 and the number of threading channels can be adjusted according to the number of gold wires and the space size, figure 1 As shown in , it is designed for 4 gold wires 8, including 4 wire passages. The wire threading channel includes the straight line entrance 2 and the straight line exit 3. The outer port of the straight line entrance 2 is the line entrance 4, and the ou...
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