Gold wire fixing structure for gold wire bonding

A fixed structure, gold wire bonding technology, applied in the direction of electric solid devices, semiconductor/solid state device components, waveguide devices, etc., can solve the problems of falling off, communication disconnection, disappearance of demand angle, etc., to reduce the loosening and falling off of solder joints risk, enhance stability and reliability, ensure the effect of bending angle

Active Publication Date: 2016-03-16
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When bonding the second end point and assembling, it is easy to cause the gold wire to be pulled by force, causing the gold wire to be straightened, and the required angle disappears; or the gold wires contact each other, resulting in a short circuit; at the same time, the gold wire solder joints are prone to loosening Even falling off, communication disconnection, in severe cases, the falling off gold wire or solder is lapped to other circuits, resulting in burnout and damage to the device

Method used

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  • Gold wire fixing structure for gold wire bonding
  • Gold wire fixing structure for gold wire bonding
  • Gold wire fixing structure for gold wire bonding

Examples

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Embodiment Construction

[0017] The specific embodiment of the present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0018] like Figure 1-3 As shown, a gold wire fixing structure for gold wire bonding is made of non-conductive materials or non-conductive and non-metallic materials, including a gold wire angle positioning piece 1, and the material of the gold wire angle positioning piece 1 is poly Ether imide, the gold wire angle positioning part 1 is provided with a plurality of mutually independent threading channels, the length of the gold wire angle positioning part 1 and the number of threading channels can be adjusted according to the number of gold wires and the space size, figure 1 As shown in , it is designed for 4 gold wires 8, including 4 wire passages. The wire threading channel includes the straight line entrance 2 and the straight line exit 3. The outer port of the straight line entrance 2 is the line entrance 4, and the ou...

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PUM

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Abstract

The invention discloses a gold wire fixing structure for gold wire bonding, and specifically relates to the technical field of gold wire bonding. The gold wire fixing structure solves the defects that an existing gold wire bonding mode does not have other fixing modes except for a mode that two ends are fixed, a gold wire is at a relatively active state, and, when the gold wire is pulled and dragged, a welding spot loosening even fall-off phenomenon occurs easily. The gold wire fixing structure for the gold wire bonding comprises a gold wire angle positioning member, the gold wire angle positioning member is provided with a plurality of mutually independent wire penetrating passageways, the wire penetrating passageways comprise wire incoming straight passageways and wire outgoing straight passageways, an outer port of each wire incoming straight passageway is a wire incoming port, an outer port of each wire outgoing straight passageway is a wire outgoing port, a 90-degree inclined angle is formed between a wire incoming direction of each wire incoming port and a wire outgoing direction of the corresponding wire outgoing port, gold wires penetrate the wire penetrating passageways, and a non-conductive adhesive is injected in gaps between the wire penetrating passageways and the gold wires.

Description

technical field [0001] The invention belongs to the technical field of gold wire bonding, and in particular relates to a gold wire fixing structure for gold wire bonding. Background technique [0002] The existing microstrip connection adopts the gold wire bonding method. After the gold wire is bonded, there is no other fixing method except the fixed points at both ends of the gold wire. The gold wire is in an active state, and the stability of the bonding angle cannot be guaranteed. When the gold wire When being pulled, it is easy to loosen or even fall off the solder joints, the stability and reliability are low, and it is easy to cause open circuit or short circuit, with serious consequences. [0003] In microwave transmission lines and microwave devices, gold wires are required for circuit connection and grounding. Due to space and bonding position requirements, gold wires need to be bent 90 degrees to ensure correct connection. The existing gold wires are directly expo...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01P3/08
CPCH01L23/48H01P3/08
Inventor 孙海波唐波张永虎王俭超王进军胡培军
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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