Lead wire cutting method, lead wire cutting device, and electronic component mounting device
A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve the problems of being unable to confirm whether there are leads, unable to confirm the installation status of electronic components, shortening, etc.
Active Publication Date: 2020-04-03
JUKI CORP
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Problems solved by technology
However, when the shape and size of the electronic component side fluctuate greatly, the lead wires may be inserted in a state in which the electronic component is inclined relative to the substrate, and the lead wires on the back surface of the substrate may become shorter or longer than a predetermined length.
If the lead wire on the back of the board is shorter than the specified length, the presence or absence of the lead wire cannot be confirmed after soldering, and the mounting state of the electronic component on the board cannot be confirmed.
On the other hand, if the leads on the back of the substrate are longer than the specified length, the leads may come into contact with electronic components on the adjacent substrate when the substrate is mounted on the device.
Method used
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[0086] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.
[0087] figure 1 It is a schematic diagram which shows the schematic structure of an electronic component mounting apparatus. figure 2 It is a perspective view showing the schematic structure of an electronic component mounting apparatus. image 3 It is a schematic diagram which shows the schematic structure of the component supply part of an electronic component mounting apparatus.
[0088] figure 1...
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The invention provides a lead cutting method, a lead cutting device and an electronic part installation device. when an electronic part is installed to a substrate, the lead cutting method can inhabit a condition that the length of a lead on the back face of the substrate fluctuates. According to the lead cutting method, the lead (84) of the electronic part (80) carried on the substrate is cut into specified lengths. In the lead cutting method, before the electronic part (80) is carried onto the substrate (8), the lead (84) of the electronic part (80) penetrates a penetrating hole (269a) formed in a carrying platform (269), and, in the state that the electronic part (80) is carried on the carrying platform (269), the lead (84) is cut into the specified lengths so that the cut leads can be directly installed to the substrate.
Description
technical field [0001] The present invention relates to a lead wire cutting method, a lead wire cutting device, and an electronic component mounting device using the lead wire cutting device for cutting a lead wire of an electronic component when mounting an electronic component on a substrate. Background technique [0002] Currently, for example, the lead wire cutting device of an electronic component described in Patent Document 1 has: an upper blade plate having a through hole through which a lead wire of an electronic component penetrating through the circuit board is inserted so as to overlap with a circuit board on which the electronic component is mounted; And a movable cutter, which is slidably arranged on the protruding side of the lead wire, that is, the upper blade surface, so as to cut the lead wire protruding from the through hole of the upper blade plate. [0003] In addition, for example, the electronic component fixing device described in Patent Document 2 is...
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IPC IPC(8): H05K13/04
Inventor 高村国章镰田将吾
Owner JUKI CORP