Upper sand tank for producing composite electroplating diamond line and its usage method

A diamond wire and composite electroplating technology, applied in electrolytic coatings, coatings, etc., can solve the problems of poor distribution of diamond powder, insufficient structure design of the sanding tank, and poor uniformity of the finished wire diameter. Control, improve efficiency and coating uniformity, the effect of uniform wire diameter

Active Publication Date: 2019-01-01
张家口原轼新型材料股份有限公司
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Problems solved by technology

The main problems of the electroplated diamond wire produced by the existing technology are poor distribution of diamond powder on the steel wire busbar, local agglomeration, and poor uniformity of the finished wire diameter, resulting in shortened diamond wire life and scratches on the cutting surface of the workpiece. , and the main reason lies in the lack of structural design of the upper sand tank in the electroplating process

Method used

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  • Upper sand tank for producing composite electroplating diamond line and its usage method
  • Upper sand tank for producing composite electroplating diamond line and its usage method

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Embodiment Construction

[0027] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0028] figure 1 Among them, an upper sand tank for producing a composite electroplating diamond wire, including an upper sand tank body, an inlet liquid circulation device, an inlet liquid distribution device, a steel wire transmission device, and the like.

[0029] The upper sand tank body 1 includes three areas, the middle area is the upper sand area, the two side areas are overflow areas, and the middle partition of the three areas is equipped with a liquid level adjustment plate 2; the lower part of the overflow area of ​​the upper sand tank body There is a return pipe 4;

[0030] figure 2 Among them, the cross section of the lower part of the upper sand area is a lower narrow trapezoid; one side of the upper sand area of ​​the upper sand tank body is equipped with a titanium basket 3, and nickel balls are housed in the titanium basket. Anode; the len...

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Abstract

The invention provides an upper sand tank for producing a composite electroplating diamond wire and a use method thereof. The electroplating sand tank mainly includes the sand tank body, liquid inlet circulation device, liquid inlet distribution device, steel wire transmission device, etc. The device adopts the liquid inlet distribution device of the multi-stage distribution pipe to enter the liquid from the bottom of the upper sand area. The longitudinal distribution of diamond particles near the steel wire busbar inside is uniform, and the sanding rate of diamond micropowder on the steel wire busbar after electrification and electroplating is controllable, and the fine powder is not easy to agglomerate and is well distributed. The invention can continuously produce the electroplated diamond wire with good distribution of diamond micropowder, uniform wire diameter and excellent cutting performance, and has reasonable structure, high production efficiency and high utilization rate of raw materials.

Description

technical field [0001] The invention relates to the technical field of composite electroplating, in particular to a sand tank device for producing composite electroplating diamond wires and a method for using the same. Background technique [0002] With the designation and implementation of the country's new energy strategic plan, the development and utilization of solar energy has become more and more important. In recent years, the demand for large-area silicon wafers for solar photovoltaic power generation has also continued to increase. Due to the maturity of semiconductor manufacturing technology, the manufacturing cost of other aspects of silicon wafers continues to decline, but limited by the development of cutting technology, the cutting cost of silicon wafers for photovoltaics has always been high, still accounting for about 30% of the total manufacturing cost. At present, the main method of cutting silicon wafers in my country is still the free abrasive cutting tec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00
CPCC25D15/00
Inventor 叶琴胡欣占晓强
Owner 张家口原轼新型材料股份有限公司
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