Tin supplying and tin soldering device and method of double-interface chip tin soldering gum application machine
A dual-interface, soldering technology, used in tin feeding devices, auxiliary devices, welding equipment, etc., can solve problems such as poor versatility and equipment accuracy effects, improve welding quality and accuracy, avoid accuracy effects, and accurately adjust height and speed. Effect
Active Publication Date: 2017-01-25
CARDMATIX
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Problems solved by technology
During the assembly process of this kind of dual-interface card, it is necessary to electrically connect the chip to the coil. It can be realized by soldering on the pads of the pads. Chinese patent 201210255794.7 discloses a double-interface chip soldering glue preparation method and its device. The wire crimping and feeding device of the group presses down and moves to feed the wire. In this wire feeding method, the crimping and feeding mechanism will frequently press down and move, so that the movement has a greater impact on the accuracy of the equipment; at the same time Due to the many standards and specifications of dual-interface cards in the market, the size of the chip pads and the spacing between the pads are also different. For chips with different pad spacings, the spacing of the tin wires needs to be adjusted to match them. Similarly, for For pads of different sizes, it is also necessary to precisely adjust the amount and pressure of solder, but the current equipment does not have this function, and the versatility is poor
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[0026] The preferred embodiments of the present invention are given below in conjunction with the accompanying drawings to describe the technical solution of the present invention in detail.
[0027] like Figure 1 to Figure 5 , an embodiment of a tin supply device for a dual-interface chip soldering adhesive machine, which is set on the frame of the dual-interface chip soldering adhesive machine, and one end of the frame is also provided with a chip material roll unwinding rack and a tin wire roll unwinding The material rack also includes a chip material tape conveying track 1, and the chip material tape conveying track 1 is arranged along the X-axis direction, and a tin supply mechanism 2 and a soldering tin mechanism 3 are sequentially arranged on the chip material tape conveying track 1 along the X-axis direction, so that The tin supply mechanism 2 includes a tin supply base 21, on which a tin supply support 22 is slidably arranged, and the tin supply support 22 is driven ...
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The invention discloses a tin supplying and tin soldering device and method of a double-interface chip tin soldering gum application machine. The device comprises a chip material belt conveying rail, wherein the chip material belt conveying rail is provided with a tin supplying mechanism and a tin soldering mechanism; the tin supplying mechanism comprises a tin supplying base; a tin supplying bracket is arranged on the tin supplying base in a sliding way; a rotatable driven guide roller set is mounted on the tin supplying bracket; a driving conveying roller set is arranged on one side of the driven guide roller set; a distance fine adjustment mechanism is arranged on one side of the driving conveying roller set; the tin soldering mechanism comprises a Y-axis linear module; the Y-axis linear module is provided with a Z-axis linear module; and the Z-axis linear module is provided with a tin soldering pressure adjusting mechanism. The distance fine adjustment mechanism is additionally arranged, so that the distance between tin wires can be adjusted to be adaptive to chips with different specifications; the tin soldering pressure is accurately adjusted, and the soldering quality and soldering precision are greatly improved; and meanwhile, in a soldering process, a servo motor drives a soldering head to be pressed down, and the height and speed of the soldering head can be accurately adjusted.
Description
technical field [0001] The invention relates to the field of processing equipment for dual-interface chips, and more specifically, relates to a tin supply device and method for a dual-interface chip solder adhesive machine. Background technique [0002] The dual-interface card is assembled from a PVC card, a chip and a coil. It is a smart card that integrates contact and non-contact interfaces. It has two operation interfaces. It can access the chip by directly contacting the chip contacts. The chip can be accessed by radio frequency at a distance. There is only one chip on the card, two interfaces, and the same operation can be performed through both the contact interface and the non-contact interface. During the assembly process of this kind of dual-interface card, it is necessary to electrically connect the chip to the coil. It can be realized by soldering on the pads of the pads. Chinese patent 201210255794.7 discloses a double-interface chip soldering glue preparation...
Claims
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IPC IPC(8): B23K3/00B23K3/06B23K3/08
CPCB23K3/00B23K3/063B23K3/08
Inventor肖康南吴韶
OwnerCARDMATIX