A laser selective melting high-efficiency forming device and method
A technology of laser selective melting and forming device, applied in the field of additive manufacturing, can solve the problems of restricting the development of laser selective melting technology and low forming efficiency of laser selective melting technology, and achieve the effect of improving forming efficiency
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2018-02-27
Smart Images

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Abstract
Description
technical field
[0001] The invention relates to the technical field of additive manufacturing, in particular to a laser selective melting high-efficiency forming device and method. Background technique
[0002] Selected laser melting (SLM) molding technology is a kind of additive manufacturing technology. This technology is based on the "discrete-accumulation" principle, and according to the slice data of the digital 3D model, the raw material powder is melted point by point, line by line, and layer by layer with a laser beam. directly produce functional parts. Compared with other metal additive manufacturing technologies, laser selective melting technology has higher forming accuracy and can form complex and fine parts. It has technical advantages such as structural and functional integrated design and manufacturing, short cycle time, near-net shape, no molds, and no tools. It is one of the most promising technologies for metal additive manufacturing technology to become a...
Examples
Embodiment
[0027] Such as Figures 1 to 4 shown. The invention discloses a high-efficiency laser selective melting forming device, which comprises a sealed forming chamber 9, a powder material cylinder 8 placed in the sealed forming chamber 9, a linear powder spreading guide rail 5, a powder spreading mechanism 7 on the linear powder spreading guide rail 5, Rotary forming platform;
[0028] The rotary molding platform includes a circular plane 3, and two molding cylinders 1 with the same structure and symmetrically distributed on its periphery are embedded in the circular plane 3; The upper surface of the cylinder is on the same horizontal plane; the center points of the two molding cylinders 1 and the center point of the circular plane 3 are on the same straight line;
[0029] The area covered by the movement track of the powder spreading mechanism 7 on the circular plane 3 is the powder spreading area, and the area below the laser melting molding station is the forming area; that is,...